LFE2M100E-5FN900C

The LFE2M100E-5FN900C is an ECP2M family field programmable gate array (FPGA) in a 900-ball BGA package. It provides a high logic capacity and on-chip memory combined with a large I/O count for board-level systems that require substantial programmable logic and connectivity.

Designed for commercial-grade applications, the device supports a supply voltage range of 1.14 V to 1.26 V and operates over a temperature range of 0 °C to 85 °C, offering a balance of integration and predictable operating conditions for mainstream embedded designs.

Key Features

• Core Logic  95,000 logic elements enable substantial custom logic implementation and complex digital functions within a single device.
• Embedded Memory  Approximately 5.4 Mbits of on-chip RAM provides local storage for buffering, state machines, and intermediate data processing.
• I/O Density  416 user I/O pins support extensive external interfacing and high-pin-count peripheral connectivity.
• Power  Supports a core supply range of 1.14 V to 1.26 V, suitable for low-voltage system designs and standard FPGA power architectures.
• Package & Mounting  900-ball BGA (900-FPBGA, 31 × 31 mm) in a surface-mount form factor provides a compact solution for high-pin-count PCB layouts.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation for mainstream commercial applications.
• Environmental Compliance  RoHS compliant to meet common regulatory requirements for electronic assemblies.

Typical Applications

• Custom logic implementation  Use the device’s 95,000 logic elements to implement complex state machines, peripherals, and application-specific accelerators on a single FPGA.
• Memory-intensive processing  Approximately 5.4 Mbits of embedded RAM supports on-chip buffering and data staging for signal processing and packet handling functions.
• High-density I/O systems  With 416 I/Os, the part is suitable for board designs requiring multiple parallel interfaces, extensive sensor arrays, or many peripheral connections.
• Compact, high-pin-count boards  The 900-BBGA (31 × 31 mm) package enables a high pin count in a compact footprint for space-constrained PCB layouts.

Unique Advantages

• High logic capacity: 95,000 logic elements allow large designs to be consolidated into a single FPGA, reducing the need for multiple devices.
• Substantial on-chip memory: Approximately 5.4 Mbits of embedded RAM minimizes external memory dependencies for many buffering and data-path tasks.
• Extensive connectivity: 416 I/Os provide flexibility for interfacing with a wide range of peripherals and board-level buses.
• High-density packaging: The 900-ball BGA (31 × 31 mm) package supports complex, high-pin-count designs while maintaining a compact board footprint.
• Commercial operating range: Rated for 0 °C to 85 °C operation to meet requirements for mainstream commercial applications and environments.
• RoHS compliant: Meets common environmental compliance needs for modern electronics manufacturing.

Why Choose LFE2M100E-5FN900C?

The LFE2M100E-5FN900C offers a balanced combination of high logic element count, significant embedded memory, and a large number of I/Os in a compact 900-BBGA package. Its commercial-grade temperature rating and RoHS compliance make it a practical choice for mainstream embedded designs that require on-chip integration of complex logic and memory resources.

This device is well suited to engineering teams and customers seeking to consolidate functionality, reduce component count, and implement feature-rich programmable logic solutions while operating within a standard commercial temperature range and low-voltage core supply window.

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