LFE2M100E-5F900C

The LFE2M100E-5F900C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor's ECP2M family. It integrates 95,000 logic elements with approximately 5.4 Mbits of embedded memory and supports 416 I/O pins, delivering a balance of logic density and on-chip RAM in a single device.

Packaged in a 900-ball BGA (900-FPBGA, 31×31) and specified for commercial temperature operation, this device is suitable for designs that require high logic capacity, substantial embedded memory, and a large I/O count within a surface-mount footprint.

Key Features

• Core Logic 95,000 logic elements provide substantial programmable logic capacity for complex glue logic, custom processing, and control functions.
• Embedded Memory Approximately 5.4 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many designs.
• I/O Density 416 available I/O pins to accommodate multiple interfaces, parallel buses, and dense I/O requirements.
• Power Supply Operates from a supply range of 1.14 V to 1.26 V, enabling integration into systems with tightly controlled core-voltage rails.
• Package & Mounting 900-BBGA (supplier device package: 900-FPBGA, 31×31) in a surface-mount form factor for compact PCB integration.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance RoHS compliant.

Typical Applications

• Communications Equipment Implement protocol handling, packet buffering, and interface adaptation using the device's combination of logic resources and embedded RAM.
• Data Acquisition & Processing Perform on-the-fly data aggregation and preprocessing where local memory and high logic capacity accelerate real-time tasks.
• High-Density I/O Systems Manage multiple parallel interfaces or sensor arrays that require a large number of I/O pins and flexible signal routing.
• Embedded Prototyping and Development Evaluate and validate complex logic and memory architectures in commercial embedded designs before production scaling.

Unique Advantages

• High Logic Density: 95,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing component count.
• Significant On-Chip Memory: Approximately 5.4 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Large I/O Capacity: 416 I/Os support complex interface mixes and parallel data paths without external I/O expanders.
• Compact, Surface-Mount Package: 900-BBGA (31×31) offers a high-density solution for space-constrained PCBs while supporting standard surface-mount assembly.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match a wide range of commercial applications and operating environments.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly and manufacturing processes.

Why Choose LFE2M100E-5F900C?

The LFE2M100E-5F900C positions itself as a capable commercial-grade FPGA for designs that require substantial programmable logic, embedded memory, and broad I/O capabilities within a compact BGA package. Its combination of 95,000 logic elements, roughly 5.4 Mbits of RAM, and 416 I/Os makes it suitable for integration where consolidation, flexibility, and on-chip memory are key considerations.

This device is well suited to engineers and procurement teams developing communications, data processing, and high-density I/O systems who need a single FPGA solution to reduce board-level complexity while maintaining design flexibility. The package, voltage, temperature, and RoHS data provide clear, verifiable parameters for system integration and long-term procurement planning.

Request a quote or submit a pricing request to evaluate the LFE2M100E-5F900C for your next design or production run.