LFE2-70SE-6FN672I

The LFE2-70SE-6FN672I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for industrial applications. It delivers a high logic element count and substantial embedded memory in a compact 672‑BBGA package, supporting designs that require dense logic, large I/O counts, and an extended operating temperature range.

Key differentiators include 68,000 logic elements, approximately 1.06 Mbits of on‑chip RAM, and up to 500 I/O, combined with an industrial temperature rating and low supply voltage range suitable for modern system designs.

Key Features

• Logic Capacity  68,000 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Total on‑chip RAM of 1,056,768 bits (approximately 1.06 Mbits) to support buffering, state storage, and local data processing.
• High I/O Count  Up to 500 I/O pins to accommodate wide peripheral connectivity and multi‑channel interfacing.
• Power Supply  Operating supply voltage range of 1.14 V to 1.26 V to match low‑voltage system rails.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Package and Mounting  672‑BBGA (27×27) supplier package in a surface‑mount form factor for compact PCB integration.
• Regulatory Compliance  RoHS‑compliant manufacturing status.

Typical Applications

• Industrial Control  Use in control systems and automation equipment where an industrial temperature range and reliable logic resources are required.
• High‑Density I/O Systems  Suitable for applications that need extensive peripheral interfacing or multi‑channel connectivity thanks to 500 available I/Os.
• Embedded Logic and Glue‑Logic  Implement custom processing, protocol bridging, and glue logic using 68,000 logic elements and on‑chip memory.

Unique Advantages

• High Logic Integration: 68,000 logic elements enable substantial on‑chip implementation of custom digital functions, reducing external component count.
• Significant On‑Chip RAM: Approximately 1.06 Mbits of embedded memory supports local buffering and state storage without relying on external memory.
• Large Number of I/Os: 500 I/O pins provide flexibility to connect many peripherals, sensors, and interfaces directly to the FPGA.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, making it suitable for demanding environmental conditions.
• Compact Package: 672‑BBGA (27×27) surface‑mount package balances high integration density with PCB space efficiency.
• Low‑Voltage Operation: 1.14 V to 1.26 V supply range supports integration into modern low‑voltage systems.

Why Choose LFE2-70SE-6FN672I?

The LFE2-70SE-6FN672I positions itself as an industrial‑grade FPGA option that combines high logic density, substantial embedded memory, and a very large I/O complement in a compact BGA package. Its operating temperature range and RoHS compliance make it suitable for designers targeting industrial and high‑reliability embedded systems.

This device is well suited for development teams and OEMs who need a scalable FPGA resource for bridging, control, and high‑I/O applications while maintaining a small PCB footprint and low supply voltage operation.

Request a quote or submit an inquiry to get pricing and availability for the LFE2-70SE-6FN672I.