LFE2-70SE-6FN900C

The LFE2-70SE-6FN900C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications. It delivers a high logic capacity and a large I/O complement in a compact 900‑BBGA package, supporting designers who require programmable logic, embedded memory, and extensive I/O integration at core supply voltages between 1.14 V and 1.26 V.

Key Features

• Logic Capacity — 68,000 logic elements to implement complex programmable logic and control functions.
• Embedded Memory — Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) for data buffering, frame storage, and local state retention.
• High I/O Count — 583 user I/O pins to support dense connectivity with peripherals, interfaces, and external devices.
• Package and Mounting — 900‑BBGA (supplier package: 900‑FPBGA, 31×31 mm) in a surface‑mount format for high pin‑count, space‑efficient designs.
• Power — Core supply range of 1.14 V to 1.26 V to match system power architectures that use low-voltage FPGA cores.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Communications Equipment — Use the high I/O count and logic capacity to implement protocol bridging, packet processing, and interface aggregation.
• Networking and Infrastructure — Deploy as programmable logic for control planes, custom header processing, or glue logic in compact, high-density systems.
• High‑Density Control Systems — Ideal for multi-channel control and signal conditioning where substantial logic and local RAM are required.
• Prototyping and Custom IP — Suitable for commercial product development where designers need a high logic element count and ample I/O to validate designs.

Unique Advantages

• High Logic Density: 68,000 logic elements enable implementation of complex state machines, datapaths, and control logic without external glue devices.
• Significant Embedded Memory: Approximately 1.06 Mbits of on-chip RAM reduces reliance on external memory for buffering and local storage.
• Extensive I/O Resources: 583 I/O pins provide flexibility to interface with numerous peripherals and parallel interfaces directly on-chip.
• Compact, High‑Pin Package: 900‑BBGA (31×31 mm) delivers high pin count in a compact footprint for space-conscious board designs.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C to meet the operating needs of commercial electronic products.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.

Why Choose LFE2-70SE-6FN900C?

The LFE2-70SE-6FN900C combines a large logic fabric, substantial embedded RAM, and very high I/O density in a compact 900‑BBGA surface‑mount package, making it well suited for commercial designs that require integrated programmable logic and extensive connectivity. Its low core voltage range and RoHS compliance align with modern power and environmental requirements.

This device is positioned for designers and organizations building commercially oriented systems that need scalable logic capacity, on‑chip memory, and dense I/O without increasing board complexity. It offers a balance of integration and deployment readiness for a broad set of commercial FPGA applications.

Request a quote or contact sales to obtain pricing and availability for the LFE2-70SE-6FN900C and to discuss how it fits your next design.