LFE2-70SE-6FN672C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 500 1056768 68000 672-BBGA |
|---|---|
| Quantity | 1,896 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 500 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8500 | Number of Logic Elements/Cells | 68000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1056768 |
Overview of LFE2-70SE-6FN672C – ECP2 FPGA, 68,000 logic elements, 500 I/Os, 672‑BBGA
The LFE2-70SE-6FN672C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a substantial logic resource, embedded memory and a high I/O count in a compact ball-grid array package.
Key device attributes include approximately 68,000 logic elements, roughly 1.06 Mbits of on‑chip RAM, up to 500 I/O pins, a 672‑BBGA (672‑FPBGA, 27×27) package, a 1.14 V to 1.26 V supply range and a commercial operating temperature range of 0 °C to 85 °C.
Key Features
- Core logic resources Approximately 8,500 CLBs and 68,000 logic elements provide the programmable fabric for custom digital implementations.
- Embedded memory Total on‑chip RAM of approximately 1.06 Mbits to support buffering, temporary storage and state machines.
- High I/O count Up to 500 general‑purpose I/O pins enable dense interfacing to external devices and systems.
- Package and mounting 672‑BBGA (supplier package: 672‑FPBGA, 27×27) in a surface‑mount format for high‑pin‑count, compact board designs.
- Power requirements Operates from a supply range of 1.14 V to 1.26 V to match system power rails.
- Temperature and grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
- RoHS compliant Device meets RoHS requirements for environmental compliance.
Unique Advantages
- High logic capacity: The combination of ~68,000 logic elements and ~8,500 CLBs supports complex, large‑scale digital designs.
- Substantial embedded memory: Approximately 1.06 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and state tasks.
- Extensive I/O resources: Up to 500 I/O pins simplify integration with multiple peripherals, sensors and external interfaces.
- Compact, high‑pin‑count package: The 672‑BBGA (27×27) provides a high density of connections in a space‑efficient surface‑mount form factor.
- Defined power and thermal envelope: Narrow supply voltage range (1.14 V–1.26 V) and a commercial temperature rating support predictable system design within specified limits.
- Environmental compliance: RoHS compliance supports regulatory and supply‑chain requirements.
Why Choose LFE2-70SE-6FN672C?
The LFE2-70SE-6FN672C combines large logic resources, on‑chip memory and a high I/O count in a 672‑BBGA surface‑mount package from Lattice Semiconductor Corporation. Its specifications make it suitable for designs that require substantial programmable logic and dense external interfacing within a commercial temperature range.
Choosing this device gives designers a balance of logic density, embedded RAM and I/O capacity in a single, RoHS‑compliant component—helpful for consolidating functions and simplifying board-level integration when those exact device attributes match project requirements.
Request a quote or submit an inquiry to receive pricing and availability for the LFE2-70SE-6FN672C.
