LFE2-70SE-6F900C

The LFE2-70SE-6F900C is an FPGA device from the Lattice ECP2 family designed for system integration where high logic density, flexible I/O and on-chip memory are required. It provides a LUT-based FPGA fabric with dedicated DSP and memory resources suited for communications, data acquisition and general embedded processing tasks.

As a surface-mount 900-ball fpBGA (31 × 31 mm) device, this commercial-grade part delivers 68,000 logic elements, up to 583 I/O pins and approximately 1.06 Mbits of embedded RAM, with a 1.14 V to 1.26 V supply and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 68,000 logic elements (LUT-based FPGA fabric) for implementing complex digital functions and system-level integration.
• On-chip Memory Approximately 1.06 Mbits of total embedded RAM (1,056,768 bits) to support code, buffering and memory-mapped data structures.
• High I/O Count Up to 583 I/O pins in the 900-ball fpBGA package to support dense board-level connectivity and multiple interface banks.
• sysDSP and DSP Capability (Family) Family documentation describes enhanced sysDSP blocks for high-performance multiply/accumulate operations (family-level feature).
• Flexible I/O Standards (Family) The family supports a wide set of programmable I/O standards, enabling interfaces to LVTTL/LVCMOS, SSTL, HSTL, LVDS and differential standards (as documented for the family).
• Package & Mounting 900-FPBGA (31 × 31 mm) package, surface-mount mounting for compact, board-level deployment.
• Power & Temperature Nominal supply range 1.14 V to 1.26 V and commercial operating temperature range 0 °C to 85 °C.
• Compliance RoHS compliant and specified as a commercial-grade device.
• Flexible Configuration (Family) Family-level configuration features include SPI boot flash interface, dual-boot image support and on-chip configuration options (as documented for the ECP2/M family).

Typical Applications

• Networking & Communications — Implements protocol processing and interface bridging where dense I/O and on-chip memory support packet buffering and custom protocol handling.
• High-speed Serial Interfaces — Family-level SERDES and PHY features enable support for high-speed serial protocols in designs that require SERDES (refer to family documentation for ECP2M-specific SERDES capability).
• Signal Processing & Data Acquisition — On-chip RAM and family sysDSP resources support DSP kernels, real-time filtering and multi-channel ADC/DAC front-end handling.
• Memory Interface and Buffering — Embedded memory and dedicated I/O gearing support source-synchronous memory interfaces and system-level buffering tasks.
• Embedded Control and System Integration — High logic density and plentiful I/O simplify integration of control, glue logic and custom peripherals into a single device.

Unique Advantages

• High Logic Density: 68,000 logic elements enable integration of complex control, processing and interface logic into a single FPGA.
• Large I/O Count: 583 I/O pins in a 900-ball fpBGA package support multiple parallel interfaces and extensive peripheral connectivity without external multiplexing.
• Substantial Embedded Memory: Approximately 1.06 Mbits of on-chip RAM reduces dependence on external memory for buffering and accelerates data-path designs.
• Compact, Surface-Mount Package: 900-FPBGA (31 × 31 mm) offers a high-pin-count solution in a compact footprint suitable for space-constrained PCBs.
• Commercial-Grade Ready: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Configurable Power Envelope: Supported supply range (1.14 V to 1.26 V) matches common FPGA power domains for straightforward board-level power design.

Why Choose LFE2-70SE-6F900C?

The LFE2-70SE-6F900C positions itself as a high-density, highly connected FPGA option for engineers building communication equipment, data acquisition systems and complex embedded controllers. Its combination of 68,000 logic elements, abundant I/O and over one megabit of on-chip RAM makes it well suited to consolidate logic, buffering and interface functions on a single device.

Backed by the Lattice ECP2 family architecture and documented family-level features such as sysDSP blocks, flexible I/O standards and advanced configuration options, this device is suitable for teams seeking scalable FPGA capacity with proven system-level capabilities and a compact package for board-level integration.

Request a quote or submit an inquiry to receive pricing and availability details for LFE2-70SE-6F900C. Our team can provide specifications and support to help evaluate this device for your design needs.