LFE2-70SE-5FN900C

The LFE2-70SE-5FN900C is an ECP2 Field Programmable Gate Array (FPGA) in a 900‑ball BGA package designed for commercial-grade applications that require programmable logic and high I/O density. It integrates a large number of logic elements and on-chip memory while operating within a low-voltage supply range, making it suitable for compact, surface-mounted electronic designs.

Key Features

• Logic Capacity — Includes 68,000 logic elements to implement complex custom logic, control functions, or protocol processing.
• Embedded Memory — Provides approximately 1.06 Mbits of on-chip RAM for buffering, state storage, and small data tables.
• High I/O Count — 583 user I/O pins to support dense peripheral and signal interfacing requirements.
• Power Supply — Operates from a 1.14 V to 1.26 V core supply range for compatibility with low-voltage system domains.
• Package and Mounting — Supplied in a 900‑BBGA package (900‑FPBGA, 31×31) optimized for surface-mount assembly and compact board layouts.
• Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory — RoHS compliant, meeting common lead-free requirements for commercial electronics.

Typical Applications

• High‑density I/O systems — Use the 583 I/O pins to consolidate multiple interfaces or to support large connector arrays on compact PCBs.
• Custom logic and protocol engines — Implement protocol translation, packet parsing, or control logic leveraging 68,000 logic elements and embedded RAM.
• Embedded system integration — Integrate glue logic, state machines, and buffering functions in commercial electronic products.

Unique Advantages

• Substantial logic resources: 68,000 logic elements enable implementation of sophisticated programmable logic without external ASICs.
• On-chip memory for buffering: Approximately 1.06 Mbits of embedded RAM reduces dependence on external memory for moderate buffering and state storage.
• Extensive I/O availability: 583 I/Os allow high peripheral counts and flexible system interfacing, simplifying board-level routing and design partitioning.
• Compact BGA package: The 900‑BBGA (900‑FPBGA, 31×31) lets designers achieve high functionality in a small footprint suitable for surface-mount assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, aligning with standard commercial product requirements.
• RoHS compliant: Meets lead‑free manufacturing and environmental compliance expectations for commercial electronics.

Why Choose LFE2-70SE-5FN900C?

The LFE2-70SE-5FN900C positions itself as a high‑capacity, commercially rated FPGA option for designs that require significant programmable logic, embedded memory, and a large number of I/O signals in a compact surface-mount package. Its combination of 68,000 logic elements, approximately 1.06 Mbits of on‑chip RAM, and 583 I/Os supports consolidation of multiple functions and reduces external component count.

This part suits engineers and product teams building commercial electronic systems that need scalable programmable logic, dense connectivity, and adherence to RoHS requirements. The device’s supply voltage and package choices make it straightforward to integrate into low‑voltage, space-constrained boards while maintaining flexibility for a range of design architectures.

Request a quote or submit an inquiry to receive pricing and availability for LFE2-70SE-5FN900C and to discuss how it can fit your next commercial FPGA design.