LFE2-70SE-6F672I

The LFE2-70SE-6F672I is an ECP2 family Field Programmable Gate Array designed for industrial applications that require high logic capacity, extensive I/O, and on-chip memory. It integrates 68,000 logic elements with substantial embedded RAM and up to 500 I/O pins in a compact 672-ball BGA package.

Key value propositions include integration density, a low-voltage core supply, and an industrial operating temperature range to support robust embedded and control designs.

Key Features

• Core Density — 68,000 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded Memory — Total on-chip RAM of 1,056,768 bits, approximately 1.06 Mbits of embedded memory for buffering, FIFOs, and state storage.
• I/O Capacity — Up to 500 programmable I/O pins to support high-density interfacing and multiple parallel connections.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match modern low-voltage system architectures.
• Package and Mounting — 672-ball BGA (supplier device package: 672-FPBGA, 27 × 27 mm) optimized for surface-mount PCB assembly and compact system layouts.
• Industrial Temperature Range — Specified for operation from −40 °C to 100 °C, rated for industrial-environment deployments.
• Regulatory — RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• Industrial Automation and Control — Leverage high logic density and industrial temperature range for machine control, PLC functions, and real-time processing at the edge.
• High-Density I/O Systems — Support boards and modules that require many parallel interfaces or dense connectivity with up to 500 I/O pins.
• Embedded Signal Processing — Use on-chip memory and extensive logic resources for data buffering, custom acceleration, and protocol handling.
• Custom Hardware and Prototyping — Suitable for prototyping mid-to-high complexity designs that need scalable logic and memory in a compact package.

Unique Advantages

• High Integration: Combines 68,000 logic elements and approximately 1.06 Mbits of embedded RAM in a single device, reducing board-level component count.
• Extensive I/O: Up to 500 I/O pins allow flexible interfacing with sensors, peripherals, and high-pin-count connectors without external multiplexing.
• Compact, Assembly-Friendly Package: 672-FPBGA (27 × 27 mm) provides a balance of pin count and PCB area for space-constrained systems.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet robust field-deployment temperature requirements.
• Low-Voltage Core: 1.14 V to 1.26 V supply range supports modern low-power system domains and power budgeting strategies.
• RoHS Compliance: Environmentally compliant for broad manufacturing and regulatory acceptance.

Why Choose LFE2-70SE-6F672I?

The LFE2-70SE-6F672I positions itself as a high-density, industrial-grade FPGA option within the ECP2 family, offering a strong combination of logic capacity, embedded memory, and a large I/O count in a compact BGA package. Its low-voltage core and wide operating temperature range make it well suited for embedded and control applications that demand reliability and integration.

This device is ideal for engineers and procurement teams building industrial automation, high-density interface modules, and custom hardware prototypes that require scalable logic resources and robust environmental performance.

Request a quote or submit a pricing inquiry today to check availability and lead times for LFE2-70SE-6F672I.