LFE2-70SE-5FN672C

The LFE2-70SE-5FN672C is an ECP2 family Field Programmable Gate Array from Lattice Semiconductor Corporation. It provides a high logic capacity and on-chip memory in a compact surface-mount 672-BBGA package, with a supply voltage range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C.

This device addresses designs that require large logic capacity and substantial I/O density while maintaining a compact board footprint and RoHS compliance.

Key Features

• Core Logic — 68,000 logic elements available for implementing complex configurable logic and system functions.
• Embedded Memory — Approximately 1.06 Mbits of on-chip RAM (1,056,768 bits) to support buffering, FIFOs, and distributed data storage.
• I/O Density — Up to 500 I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 672-BBGA / 672-FPBGA (27×27 mm) surface-mount package for high-density board integration.
• Power — Operates from a supply voltage range of 1.14 V to 1.26 V, suitable for systems with tight core-voltage requirements.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑I/O Systems — Designs that require up to 500 I/Os for parallel interfaces, connectors, or multi‑channel peripherals.
• Memory‑Assisted Logic — Architectures that leverage approximately 1.06 Mbits of embedded RAM for buffering and packet processing.
• Dense Board Integration — Applications benefiting from a compact 672‑BBGA surface‑mount package to maximize PCB routing and reduce footprint.

Unique Advantages

• High Logic Capacity: 68,000 logic elements enable substantial on‑chip implementation of custom digital logic and state machines.
• Significant On‑Chip RAM: Approximately 1.06 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage tasks.
• Extensive I/O Count: 500 I/Os support broad interface requirements without immediate need for external I/O expanders.
• Compact, High‑Density Package: 672‑FBGA (27×27 mm) surface‑mount package supports high‑density PCB layouts and constrained board space.
• Controlled Core Voltage: Narrow supply range (1.14 V–1.26 V) supports consistent core power management in regulated systems.
• RoHS Compliant: Meets environmental regulatory requirements for lead‑free assembly flows.

Why Choose LFE2-70SE-5FN672C?

The LFE2-70SE-5FN672C positions itself as a high‑capacity, commercially graded FPGA option for designs that demand large logic resources, broad I/O connectivity, and meaningful on‑chip RAM in a compact surface‑mount package. Its combination of 68,000 logic elements, roughly 1.06 Mbits of embedded memory, and up to 500 I/Os makes it suitable for mid-to-high complexity digital designs where board space and integration are priorities.

Choose this device when you need a RoHS‑compliant FPGA with a compact 672‑BBGA form factor, a tightly defined core voltage window, and a commercial temperature rating for standard embedded and OEM applications.

Request a quote or submit an inquiry to get pricing and availability information for the LFE2-70SE-5FN672C.