LFE2-70E-6F900I

The LFE2-70E-6F900I is an ECP2 family field-programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a high-density programmable fabric with 68,000 logic elements and approximately 1.06 Mbits of embedded memory for implementing custom digital logic and system functions.

With 583 user I/Os, a 900-ball BBGA package (900-FPBGA, 31×31), industrial-grade temperature range, and a low core supply voltage of 1.14 V to 1.26 V, this device targets designs that require significant logic capacity, large on-chip memory, and extensive I/O connectivity in a compact surface-mount package.

Key Features

• Core Logic  Built with 68,000 logic elements to support large-scale, custom digital designs and complex IP integration.
• Embedded Memory  Approximately 1.06 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing without external memory.
• I/O Capacity  583 user I/Os enabling broad peripheral, sensor, and high-density interface connectivity within a single device.
• Power  Core supply voltage range of 1.14 V to 1.26 V for the FPGA fabric.
• Package & Mounting  900-BBGA (supplier package: 900-FPBGA, 31×31) in a surface-mount form factor for high pin-count designs in a compact footprint.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C to meet robust environmental requirements.
• Regulatory Compliance  RoHS-compliant for environmentally conscious designs.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating, high logic capacity, and large I/O count for motor control, PLCs, and automation interfaces.
• Communications Equipment  Leverage the extensive I/O and embedded memory for protocol handling, packet processing, and interface bridging.
• Embedded Systems  Integrate complex custom logic and buffering directly on-chip to reduce external components and simplify system architecture.
• Data Aggregation and Interface Conversion  High I/O count and significant logic resources enable aggregation of multiple high-speed signals and format conversion within a single FPGA.

Unique Advantages

• Highly integrated solution: Combines 68,000 logic elements with approximately 1.06 Mbits of embedded memory to consolidate functions and reduce external component count.
• Exceptional I/O density: 583 user I/Os provide flexibility for multi-protocol interfaces, sensor arrays, and parallel connections without additional multiplexing hardware.
• Industrial robustness: Rated for −40 °C to 100 °C operation to support demanding environmental deployments.
• Compact, high-pin-count package: 900-BBGA (900-FPBGA, 31×31) allows dense pinout in a surface-mount form factor for space-constrained PCBs.
• Low-voltage core operation: 1.14 V to 1.26 V supply range supports modern power-optimized system designs.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assemblies.

Why Choose LFE2-70E-6F900I?

The LFE2-70E-6F900I delivers a combination of high logic capacity, substantial embedded memory, and expansive I/O in a single industrial-grade FPGA package. This balance of resources and environmental tolerance makes it well suited to designs that demand dense logic integration, significant on-chip buffering, and broad interface support.

Backed by Lattice Semiconductor Corporation, the device is aimed at engineers and procurement teams seeking a robust, high-density programmable solution that simplifies board-level integration while providing the scalability needed for complex embedded and industrial systems.

Request a quote or submit an inquiry to get pricing, availability, and additional ordering information for the LFE2-70E-6F900I.