LFE2M20SE-5F484C

IC FPGA 304 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA

Quantity 1,471 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O304Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2375Number of Logic Elements/Cells19000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1246208

Overview of LFE2M20SE-5F484C – ECP2M FPGA, 19,000 logic elements, 304 I/Os, 484-BBGA

The LFE2M20SE-5F484C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offered in a 484-ball BGA package. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count for commercial designs.

With approximately 19,000 logic elements, roughly 1.246 Mbits of embedded memory, and 304 I/Os, this device is suited to designs that require moderate logic density, substantial embedded RAM, and extensive external connectivity while operating within a commercial temperature range.

Key Features

  • Core Logic Approximately 19,000 logic elements (logic element cells) to implement custom logic and IP cores.
  • Embedded Memory Total on-chip RAM of 1,246,208 bits — approximately 1.246 Mbits of embedded memory for buffering, lookup tables, and data storage.
  • I/O Density Up to 304 general-purpose I/Os to support broad external interfacing and parallel connectivity.
  • Power Supply Supported core voltage range of 1.14 V to 1.26 V to match system power domains and low-voltage designs.
  • Package & Mounting 484-ball BGA in a 484-FPBGA (23 × 23) footprint with surface-mount package type for compact board integration.
  • Temperature & Grade Commercial grade device rated for operation from 0°C to 85°C.
  • Regulatory Compliance RoHS compliant for lead-free assembly processes and environmental requirements.

Typical Applications

  • High-density I/O aggregation — Use the 304 I/Os to consolidate signals from multiple peripherals or interfaces in communication and connectivity modules.
  • Embedded memory buffering — Leverage approximately 1.246 Mbits of on-chip RAM for data buffering, packet handling, or temporary storage in streaming applications.
  • Custom logic implementation — Implement custom protocol handling, glue logic, and IP cores utilizing the 19,000 logic elements for commercial embedded systems.

Unique Advantages

  • High logic density: Approximately 19,000 logic elements enable implementation of substantive custom logic within a single FPGA device, reducing the need for multiple discrete components.
  • Substantial embedded memory: Around 1.246 Mbits of on-chip RAM provides on-device storage for buffering and LUT-based functions, minimizing external memory dependence.
  • Extensive I/O resources: 304 I/Os offer flexibility for parallel interfaces, sensor arrays, and multi-channel I/O designs.
  • Compact BGA footprint: The 484-FPBGA (23×23) package delivers high pin density in a space-efficient surface-mount form factor for compact PCBs.
  • Low-voltage core compatibility: Core supply range of 1.14 V to 1.26 V allows integration with modern low-voltage power architectures.
  • RoHS compliant: Conforms to lead-free assembly requirements for environmentally conscious manufacturing.

Why Choose LFE2M20SE-5F484C?

The LFE2M20SE-5F484C positions itself as a balanced FPGA choice for commercial embedded designs that require a combination of moderate logic capacity, meaningful on-chip memory, and a high number of I/Os in a compact BGA package. Its voltage range, package density, and RoHS compliance make it suitable for streamlined board integration and standard manufacturing flows.

Designers and procurement teams targeting scalable FPGA-based solutions can rely on this part for consolidating logic functions, reducing BOM complexity, and supporting applications that operate within a 0°C to 85°C commercial temperature window.

Request a quote or submit a quote for LFE2M20SE-5F484C today to evaluate this FPGA for your next design project.

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