LFE2M20SE-5F484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 1,471 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 304 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20SE-5F484C – ECP2M FPGA, 19,000 logic elements, 304 I/Os, 484-BBGA
The LFE2M20SE-5F484C is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offered in a 484-ball BGA package. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count for commercial designs.
With approximately 19,000 logic elements, roughly 1.246 Mbits of embedded memory, and 304 I/Os, this device is suited to designs that require moderate logic density, substantial embedded RAM, and extensive external connectivity while operating within a commercial temperature range.
Key Features
- Core Logic Approximately 19,000 logic elements (logic element cells) to implement custom logic and IP cores.
- Embedded Memory Total on-chip RAM of 1,246,208 bits — approximately 1.246 Mbits of embedded memory for buffering, lookup tables, and data storage.
- I/O Density Up to 304 general-purpose I/Os to support broad external interfacing and parallel connectivity.
- Power Supply Supported core voltage range of 1.14 V to 1.26 V to match system power domains and low-voltage designs.
- Package & Mounting 484-ball BGA in a 484-FPBGA (23 × 23) footprint with surface-mount package type for compact board integration.
- Temperature & Grade Commercial grade device rated for operation from 0°C to 85°C.
- Regulatory Compliance RoHS compliant for lead-free assembly processes and environmental requirements.
Typical Applications
- High-density I/O aggregation — Use the 304 I/Os to consolidate signals from multiple peripherals or interfaces in communication and connectivity modules.
- Embedded memory buffering — Leverage approximately 1.246 Mbits of on-chip RAM for data buffering, packet handling, or temporary storage in streaming applications.
- Custom logic implementation — Implement custom protocol handling, glue logic, and IP cores utilizing the 19,000 logic elements for commercial embedded systems.
Unique Advantages
- High logic density: Approximately 19,000 logic elements enable implementation of substantive custom logic within a single FPGA device, reducing the need for multiple discrete components.
- Substantial embedded memory: Around 1.246 Mbits of on-chip RAM provides on-device storage for buffering and LUT-based functions, minimizing external memory dependence.
- Extensive I/O resources: 304 I/Os offer flexibility for parallel interfaces, sensor arrays, and multi-channel I/O designs.
- Compact BGA footprint: The 484-FPBGA (23×23) package delivers high pin density in a space-efficient surface-mount form factor for compact PCBs.
- Low-voltage core compatibility: Core supply range of 1.14 V to 1.26 V allows integration with modern low-voltage power architectures.
- RoHS compliant: Conforms to lead-free assembly requirements for environmentally conscious manufacturing.
Why Choose LFE2M20SE-5F484C?
The LFE2M20SE-5F484C positions itself as a balanced FPGA choice for commercial embedded designs that require a combination of moderate logic capacity, meaningful on-chip memory, and a high number of I/Os in a compact BGA package. Its voltage range, package density, and RoHS compliance make it suitable for streamlined board integration and standard manufacturing flows.
Designers and procurement teams targeting scalable FPGA-based solutions can rely on this part for consolidating logic functions, reducing BOM complexity, and supporting applications that operate within a 0°C to 85°C commercial temperature window.
Request a quote or submit a quote for LFE2M20SE-5F484C today to evaluate this FPGA for your next design project.