LFE2M20E-7FN256C

The LFE2M20E-7FN256C is a field programmable gate array (FPGA) in a 256-ball BGA package designed for commercial applications. It integrates approximately 19,000 logic elements and about 1.246 Mbits of embedded memory with 140 I/O pins, providing a balance of logic density, on‑chip memory, and I/O capability for mid-range programmable designs. The device operates from a 1.14 V to 1.26 V supply and is rated for commercial temperature operation (0 °C to 85 °C), making it suitable for a wide range of general-purpose embedded and interface tasks.

Key Features

• Core Density  Approximately 19,000 logic elements and 2,375 logic blocks to support moderate-complexity logic implementations.
• Embedded Memory  Approximately 1.246 Mbits of on-chip RAM for buffering, state storage, and small embedded data structures.
• I/O Capability  140 I/O pins to accommodate multiple parallel interfaces, sensor arrays, or peripheral connections.
• Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match modern low-voltage system domains.
• Package and Mounting  256-ball FPBGA (17 × 17 mm) surface-mount package for compact board-level integration.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C and RoHS compliant for environmental regulatory alignment.

Typical Applications

• Embedded Control and Glue Logic  With its logic density and 140 I/O, this FPGA is suitable for implementing glue logic, protocol bridging, and custom control functions in embedded systems.
• Interface Concentration  The combination of on‑chip RAM and ample I/O supports aggregation and buffering of multiple serial or parallel interfaces.
• Prototyping and Development  The device’s mid-range capacity makes it useful for prototyping custom logic blocks and validating system-level functions before scaling.
• Communications and Peripherals  Ideal for managing peripheral interfaces and midsize datapath logic where moderate embedded memory and flexible I/O are required.

Unique Advantages

• Balanced Logic and Memory:  Approximately 19,000 logic elements paired with ~1.246 Mbits of embedded RAM offers a practical middle ground for designs that need both logic density and local memory.
• Generous I/O Count:  140 I/O pins enable flexible connectivity to sensors, peripherals, and external devices without immediate need for expansion chips.
• Compact BGA Package:  The 256-FPBGA (17×17) package delivers a space-efficient footprint for board designs with moderate routing density.
• Low-Voltage Core:  Operation at 1.14 V–1.26 V aligns the device with contemporary low-voltage system architectures to streamline power domain design.
• Commercial Temperature Range:  Rated for 0 °C to 85 °C, suitable for general-purpose commercial applications and environments.
• RoHS Compliant:  Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Why Choose LFE2M20E-7FN256C?

The LFE2M20E-7FN256C offers a practical combination of logic capacity, embedded memory, and I/O count in a compact 256-BGA package, positioned for commercial embedded designs that require moderate programmable logic resources. Its low-voltage operation and RoHS compliance make it appropriate for modern boards where power efficiency and environmental compliance matter.

This FPGA is suited to engineers and procurement teams building mid-range programmable solutions — from interface consolidation and control logic to prototype validation — who need a dependable, commercially graded device with clear, verifiable specifications.

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