LFE2M20E-7F484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 856 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 304 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20E-7F484C – ECP2M Field Programmable Gate Array (FPGA), 19,000 logic elements, approximately 1.246 Mbits RAM, 304 I/O, 484-BBGA
The LFE2M20E-7F484C is a commercial-grade Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-density programmable fabric with 19,000 logic elements and approximately 1.246 Mbits of on-chip RAM in a compact BGA package.
With 304 user I/O and a low-voltage supply range of 1.14 V to 1.26 V, this device is suited to commercial embedded designs that require significant I/O capacity and on-chip memory within a surface-mount 484-ball BGA footprint.
Key Features
- Logic Capacity — 19,000 logic elements to implement a wide range of combinational and sequential logic functions.
- Embedded Memory — Approximately 1.246 Mbits of on-chip RAM for data buffering, FIFOs, and small packet storage.
- I/O Resources — 304 I/O pins providing broad interfacing options for peripherals, sensors, and buses.
- Power — Operates from a 1.14 V to 1.26 V supply range to match low-voltage system requirements.
- Package and Mounting — Surface-mount 484-BBGA package; supplier device package 484-FPBGA (23×23) for compact board-level integration.
- Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C for standard commercial environments.
- RoHS Compliance — Device is RoHS compliant, supporting regulatory requirements for lead-free assembly.
Typical Applications
- High-density I/O control — 304 I/O pins enable control and interfacing for multi-channel digital I/O, bus bridging, and peripheral aggregation.
- Embedded logic acceleration — 19,000 logic elements are suitable for offloading custom logic functions from a host processor in embedded systems.
- On-chip data buffering — Approximately 1.246 Mbits of embedded RAM supports temporary storage, buffering, and small packet handling without external memory.
- Compact board designs — The 484-ball BGA (484-FPBGA, 23×23) package supports space-constrained PCBs requiring a high-pin-count programmable device.
Unique Advantages
- High logic density: 19,000 logic elements provide substantial programmable capacity for mid-range FPGA designs.
- Significant on-chip memory: Approximately 1.246 Mbits of embedded RAM reduces or eliminates the need for external memory for many buffering tasks.
- Extensive I/O: 304 I/O pins allow flexible interfacing and reduce the need for external multiplexing or expanders.
- Low-voltage operation: Narrow supply range (1.14 V–1.26 V) helps integration into low-voltage system domains.
- Compact package: 484-BBGA / 484-FPBGA (23×23) enables a high-pin-count solution in a small board footprint.
- RoHS-compliant: Meets lead-free assembly requirements for commercial electronic products.
Why Choose LFE2M20E-7F484C?
The LFE2M20E-7F484C is positioned as a mid-density commercial FPGA that balances programmable logic capacity, embedded memory, and a large I/O count in a compact BGA package. Its combination of 19,000 logic elements, approximately 1.246 Mbits of on-chip RAM, and 304 I/O makes it a practical choice for embedded designs that need substantial local logic and interfacing without expanding board complexity.
Manufactured by Lattice Semiconductor Corporation and supplied in a surface-mount 484-BBGA package, this device is suited to design teams and procurement groups targeting commercial-temperature, RoHS-compliant FPGA solutions for space-constrained and I/O-rich applications.
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