LFE2M20SE-5F256I

IC FPGA 140 I/O 256FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 140 1246208 19000 256-BGA

Quantity 1,835 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O140Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2375Number of Logic Elements/Cells19000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1246208

Overview of LFE2M20SE-5F256I – ECP2M FPGA, 19,000 logic elements, 256-FPBGA

The LFE2M20SE-5F256I is an industrial-grade Lattice ECP2M family Field Programmable Gate Array supplied in a 256-ball fpBGA package. It delivers 19,000 logic elements, approximately 1.25 Mbits of embedded RAM, and 140 I/Os to support mid-range system integration in communications, industrial, and datacom applications.

Designed for low-voltage operation (1.14–1.26 V) and rated for -40 °C to 100 °C, this device combines FPGA fabric, DSP capabilities and the LatticeECP2M family’s high-speed I/O and SERDES features to enable compact, robust designs.

Key Features

  • Core Logic — 19,000 logic elements suitable for mid-density logic integration and glue-logic consolidation.
  • Embedded Memory — Total on-chip RAM of 1,246,208 bits (approximately 1.25 Mbits) for FPGA-local buffering and packet/stream storage.
  • DSP and Acceleration — Family-level sysDSP blocks for high-performance multiply-accumulate operations, enabling signal processing and real-time data manipulation.
  • High-Speed Serial and Source-Synchronous I/O — ECP2M family includes embedded SERDES (family feature) and pre-engineered source synchronous I/O to support protocols such as PCI Express and Ethernet, and to interface with high-speed ADC/DAC devices.
  • Programmable I/O Standards — sysI/O buffer support across a wide range of standards including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL, LVDS, RSDS, Bus-LVDS, MLVDS and LVPECL (per family documentation).
  • Configuration Flexibility — Family-level features include SPI boot flash interface, dual boot image support and optional bitstream encryption for "S" versions.
  • Package and Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board integration.
  • Industrial Temperature Range — Rated for -40 °C to 100 °C to meet industrial environment requirements.
  • RoHS Compliant — Conforms to RoHS environmental standards.

Typical Applications

  • Networking & Telecom Equipment — Implement protocol processing, packet buffering and high-speed serial interfaces leveraging the family’s SERDES and programmable I/O.
  • Industrial Control & Automation — Use FPGA logic and embedded memory for real-time control, protocol translation and sensor/interface consolidation across industrial temperature ranges.
  • Data Acquisition & Signal Processing — Deploy sysDSP blocks and source-synchronous I/O to interface with ADC/DAC front ends and perform real-time filtering and processing.
  • Embedded System Integration — Combine logic, memory and flexible I/O standards to reduce board-level component count in compact, industrial designs.

Unique Advantages

  • High Logic Density: 19,000 logic elements provide ample capacity for mid-range FPGA designs without excessive board area.
  • Integrated On-Chip Memory: Approximately 1.25 Mbits of embedded RAM reduces external memory dependence for buffering and local data storage.
  • Flexible I/O and SERDES Support: Family-level SERDES and broad I/O standard support simplify integration with high-speed serial links and mixed-signal peripherals.
  • Industrial Reliability: Rated operation from -40 °C to 100 °C supports deployment in demanding industrial environments.
  • Compact Package: 256-FPBGA (17 × 17 mm) package enables space-efficient PCBs while maintaining up to 140 I/Os.
  • Ecosystem Support: The ECP2/M family is supported by Lattice design tools and family-level features such as SPI boot and optional bitstream encryption, aiding development and field updates.

Why Choose LFE2M20SE-5F256I?

LFE2M20SE-5F256I positions itself as a practical, industrial-grade FPGA option for designers who need a balance of logic capacity, embedded memory and flexible I/O in a compact package. Its mid-range logic density and family-proven features like sysDSP and SERDES make it suitable for communications, industrial control and data acquisition systems.

With RoHS compliance, a 1.14–1.26 V core supply window and a wide operating temperature range, this device supports robust, long-lived designs and streamlined board-level integration. The ECP2/M family’s configuration options and toolchain support help accelerate development and deployment.

Request a quote or submit a product inquiry for the LFE2M20SE-5F256I to receive pricing, availability and technical purchasing details.

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