LFE2M20SE-5F256I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 1246208 19000 256-BGA |
|---|---|
| Quantity | 1,835 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20SE-5F256I – ECP2M FPGA, 19,000 logic elements, 256-FPBGA
The LFE2M20SE-5F256I is an industrial-grade Lattice ECP2M family Field Programmable Gate Array supplied in a 256-ball fpBGA package. It delivers 19,000 logic elements, approximately 1.25 Mbits of embedded RAM, and 140 I/Os to support mid-range system integration in communications, industrial, and datacom applications.
Designed for low-voltage operation (1.14–1.26 V) and rated for -40 °C to 100 °C, this device combines FPGA fabric, DSP capabilities and the LatticeECP2M family’s high-speed I/O and SERDES features to enable compact, robust designs.
Key Features
- Core Logic — 19,000 logic elements suitable for mid-density logic integration and glue-logic consolidation.
- Embedded Memory — Total on-chip RAM of 1,246,208 bits (approximately 1.25 Mbits) for FPGA-local buffering and packet/stream storage.
- DSP and Acceleration — Family-level sysDSP blocks for high-performance multiply-accumulate operations, enabling signal processing and real-time data manipulation.
- High-Speed Serial and Source-Synchronous I/O — ECP2M family includes embedded SERDES (family feature) and pre-engineered source synchronous I/O to support protocols such as PCI Express and Ethernet, and to interface with high-speed ADC/DAC devices.
- Programmable I/O Standards — sysI/O buffer support across a wide range of standards including LVTTL, LVCMOS (3.3/2.5/1.8/1.5/1.2 V), SSTL, HSTL, LVDS, RSDS, Bus-LVDS, MLVDS and LVPECL (per family documentation).
- Configuration Flexibility — Family-level features include SPI boot flash interface, dual boot image support and optional bitstream encryption for "S" versions.
- Package and Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board integration.
- Industrial Temperature Range — Rated for -40 °C to 100 °C to meet industrial environment requirements.
- RoHS Compliant — Conforms to RoHS environmental standards.
Typical Applications
- Networking & Telecom Equipment — Implement protocol processing, packet buffering and high-speed serial interfaces leveraging the family’s SERDES and programmable I/O.
- Industrial Control & Automation — Use FPGA logic and embedded memory for real-time control, protocol translation and sensor/interface consolidation across industrial temperature ranges.
- Data Acquisition & Signal Processing — Deploy sysDSP blocks and source-synchronous I/O to interface with ADC/DAC front ends and perform real-time filtering and processing.
- Embedded System Integration — Combine logic, memory and flexible I/O standards to reduce board-level component count in compact, industrial designs.
Unique Advantages
- High Logic Density: 19,000 logic elements provide ample capacity for mid-range FPGA designs without excessive board area.
- Integrated On-Chip Memory: Approximately 1.25 Mbits of embedded RAM reduces external memory dependence for buffering and local data storage.
- Flexible I/O and SERDES Support: Family-level SERDES and broad I/O standard support simplify integration with high-speed serial links and mixed-signal peripherals.
- Industrial Reliability: Rated operation from -40 °C to 100 °C supports deployment in demanding industrial environments.
- Compact Package: 256-FPBGA (17 × 17 mm) package enables space-efficient PCBs while maintaining up to 140 I/Os.
- Ecosystem Support: The ECP2/M family is supported by Lattice design tools and family-level features such as SPI boot and optional bitstream encryption, aiding development and field updates.
Why Choose LFE2M20SE-5F256I?
LFE2M20SE-5F256I positions itself as a practical, industrial-grade FPGA option for designers who need a balance of logic capacity, embedded memory and flexible I/O in a compact package. Its mid-range logic density and family-proven features like sysDSP and SERDES make it suitable for communications, industrial control and data acquisition systems.
With RoHS compliance, a 1.14–1.26 V core supply window and a wide operating temperature range, this device supports robust, long-lived designs and streamlined board-level integration. The ECP2/M family’s configuration options and toolchain support help accelerate development and deployment.
Request a quote or submit a product inquiry for the LFE2M20SE-5F256I to receive pricing, availability and technical purchasing details.

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