LFE2M20E-6FN256I

The LFE2M20E-6FN256I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2M family. It delivers a combination of configurable logic, embedded memory, and a substantial I/O count in a compact 256-BGA package.

With 19,000 logic elements, approximately 1.246 Mbits of embedded memory, 140 I/O, and an industrial operating temperature range, this device is suited for designs that require moderate logic capacity, on-chip RAM, and robust environmental tolerance.

Key Features

• Core Logic  Approximately 19,000 logic elements for implementing custom digital functions and user-defined logic.
• Logic Blocks  2,375 logic blocks provide a structured fabric for building combinational and sequential logic.
• Embedded Memory  Approximately 1.246 Mbits (1,246,208 bits) of on-chip RAM to support buffering, state storage, and data processing.
• I/O Capability  140 I/O pins to interface with external peripherals, sensors, and communication endpoints.
• Power Requirements  Nominal supply voltage range of 1.14 V to 1.26 V to match specified core power rails.
• Package & Mounting  256-BGA (supplier package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for applications requiring extended temperature tolerance.
• RoHS Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial control  Implement custom control logic and signal conditioning in systems that require operation across an industrial temperature range.
• Embedded systems  Use the device’s logic density and on-chip RAM to integrate glue logic, protocol bridging, and custom accelerators in compact designs.
• Interfaces and peripheral aggregation  Consolidate multiple I/O and protocol handling functions into a single FPGA to simplify board-level integration.

Unique Advantages

• Balanced logic and memory capacity: 19,000 logic elements combined with approximately 1.246 Mbits of embedded memory supports diverse digital functions without immediate external RAM needs.
• High I/O count: 140 I/O pins enable broad connectivity for sensors, peripherals, and external interfaces.
• Industrial-grade temperature support: −40 °C to 100 °C rating allows deployment in environments with wide temperature variation.
• Compact BGA packaging: 256-FPBGA (17 × 17) keeps the PCB footprint small while providing ample I/O and thermal characteristics for surface-mount assembly.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures.

Why Choose LFE2M20E-6FN256I?

The LFE2M20E-6FN256I offers a practical combination of logic density, embedded memory, and I/O in a compact industrial-grade package. It is well suited to engineers looking to consolidate custom digital functions and interface logic into a single FPGA while maintaining a small board footprint and extended temperature capability.

This part is appropriate for development and production designs that require mid-range programmable logic, on-chip RAM capacity, and broad I/O, packaged for surface-mount PCB assembly.

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