LFE2M20E-6FN256C

The LFE2M20E-6FN256C is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2M family. It provides a mid-range balance of logic capacity, on-chip memory and I/O in a compact 256-ball BGA package for commercial electronic designs.

Key silicon characteristics include 19,000 logic elements, approximately 1.25 Mbits of embedded RAM, and 140 available I/O points, with a nominal supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  19,000 logic elements provide programmable fabric to implement custom digital logic, state machines and glue logic.
• Embedded Memory  Approximately 1.25 Mbits of on-chip RAM (1,246,208 total RAM bits) for buffering, FIFOs and local data storage within designs.
• I/O Capability  140 user I/O pins to support a variety of parallel and serial interface needs on a single device.
• Power  Core supply range from 1.14 V to 1.26 V to match platform power rails and enable predictable power budgeting.
• Package and Mounting  256-ball BGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting for compact board-level integration.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

• Custom digital logic  Implement control logic, state machines and protocol bridging using the device’s 19,000 logic elements and on-chip RAM.
• I/O expansion and interfacing  Use the 140 I/O pins to connect sensors, peripherals and external components where flexible pin assignments are required.
• Data buffering and packet handling  Leverage approximately 1.25 Mbits of embedded RAM for temporary storage, packet buffering and FIFO implementations.

Unique Advantages

• Balanced resource mix: The combination of 19,000 logic elements and substantial embedded RAM supports designs that need both logic density and on-chip memory.
• High I/O count: 140 I/O pins give designers flexibility to implement multi-peripheral systems without additional interface ICs.
• Compact board footprint: The 256-FPBGA (17×17) package enables high-density placement for space-constrained PCBs while maintaining robust connectivity.
• Predictable power envelope: A defined core supply range (1.14 V to 1.26 V) simplifies power supply design and analysis for system integration.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of standard commercial applications.
• RoHS compliance: Conforms to RoHS environmental requirements for lead-free manufacturing processes.

Why Choose LFE2M20E-6FN256C?

The LFE2M20E-6FN256C positions itself as a mid-range FPGA option that combines a substantial logic element count, ample embedded RAM and a high I/O pin count in a compact 256-BGA package. These characteristics make it well suited to commercial designs that require on-chip programmability, local memory buffering and flexible interfacing without occupying excessive board area.

Designers seeking a commercially rated, RoHS-compliant FPGA with clear power and temperature characteristics can leverage this device to implement customized digital functions while maintaining predictable integration and assembly in surface-mount PCB workflows.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2M20E-6FN256C. Our team can provide lead-time and order details to support your project timeline.