LFE2M20E-6F256C

The LFE2M20E-6F256C is an ECP2M family Field Programmable Gate Array (FPGA) IC designed for commercial applications. It delivers a combination of programmable logic capacity, on-chip embedded memory, and a high I/O count in a compact 256-ball BGA package.

This device targets designs that require up to 19,000 logic elements, approximately 1.25 Mbits of embedded memory, and 140 user I/Os while operating within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Programmable Logic Capacity — 19,000 logic elements to implement custom digital functions and moderate-density logic designs.
• On‑Chip Memory — Approximately 1.25 Mbits of embedded RAM for buffering, temporary storage, and local data processing.
• I/O Density — 140 user I/Os to support multiple external interfaces, parallel buses, and peripheral connections.
• Power Supply — Narrow core voltage range of 1.14 V to 1.26 V to match target system power rails and simplify power sequencing.
• Package & Mounting — 256-ball FPBGA (17 × 17) package for surface-mount assembly, balancing size and thermal/conductivity for board-level integration.
• Operating Grade & Temperature — Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Implement control logic, data aggregation, and custom peripherals using the device’s logic and embedded RAM.
• Communications Equipment — Support protocol handling, packet buffering, and interface bridging with 140 available I/Os and on-chip memory.
• Prototyping and Development — Rapidly prototype digital functions and validate system architectures with reprogrammable logic capacity.
• Peripheral & Interface Control — Drive multiple external peripherals and parallel interfaces leveraging the device’s high I/O count.

Unique Advantages

• Substantial Logic Resource: 19,000 logic elements provide ample capacity for medium-density designs without moving to larger device families.
• Integrated Memory: Approximately 1.25 Mbits of embedded RAM reduces external memory needs for buffering and local data handling.
• High I/O Count: 140 I/Os enable versatile board-level connectivity and support for multiple interfaces in a single device.
• Compact Package: 256-FPBGA (17×17) offers a compact footprint for space-constrained PCBs while supporting surface-mount assembly processes.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial electronics deployment conditions.
• RoHS Compliant: Meets environmental compliance expectations for commercial product assembly.

Why Choose LFE2M20E-6F256C?

The LFE2M20E-6F256C delivers a balanced combination of programmable logic density, embedded memory, and a high number of I/Os in a compact BGA package suitable for commercial-grade designs. It is well suited for engineers seeking a reprogrammable device that consolidates control, interface, and buffering functions while keeping board area and external component count under control.

With defined electrical and thermal parameters—core voltage between 1.14 V and 1.26 V and an operating range of 0 °C to 85 °C—this FPGA fits a wide range of commercial embedded and communications applications where predictable, verifiable specifications are required.

If you would like pricing, availability, or to request a quote for LFE2M20E-6F256C, submit a request and our team will respond with a tailored quote and lead-time information.