LFE2M20E-5FN484I

IC FPGA 304 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA

Quantity 1,175 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O304Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2375Number of Logic Elements/Cells19000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1246208

Overview of LFE2M20E-5FN484I – ECP2M FPGA · 304 I/Os · ~1.246 Mbit RAM · 19,000 logic elements · 484-BBGA

The LFE2M20E-5FN484I is a Lattice ECP2M family Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package. It integrates approximately 19,000 logic elements and roughly 1.246 Mbits of embedded RAM, providing a balance of logic density and on-chip memory for industrial designs.

With 304 user I/Os, a 1.14–1.26 V core supply range, and an industrial operating temperature range of −40 °C to 100 °C, this device addresses applications requiring moderate logic capacity, significant I/O bandwidth, and extended temperature support.

Key Features

  • Logic Capacity  Approximately 19,000 logic elements for implementing mid-range combinational and sequential logic.
  • On-chip Memory  Approximately 1.246 Mbits of embedded memory to store buffers, FIFOs and state data directly on the device.
  • I/O Density  304 user I/Os to support multiple parallel interfaces, sensor arrays, or mixed-signal front-ends.
  • Supply Voltage  Core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
  • Package & Mounting  484-ball FPBGA (23 × 23 mm) package, surface-mount mounting type for compact board integration.
  • Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C for deployments in extended-temperature environments.
  • Family Capabilities (ECP2/M)  Includes the ECP2/M family feature set from the datasheet such as advanced DSP blocks, flexible memory resources, and high-speed SERDES support (as applicable to ECP2M family devices).
  • RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

  • Industrial Control  Use for I/O aggregation, protocol bridging, and control logic where extended temperature range and robust I/O count are required.
  • Networking & Connectivity  Suitable for mid-range communication endpoints and protocol adaptation leveraging the ECP2M family’s high-speed serial and interface capabilities.
  • Embedded Processing Acceleration  Implement hardware accelerators, DSP preprocessing, and custom state machines using available logic elements and embedded RAM.
  • Test & Measurement  Ideal for data acquisition front ends and timing-critical sampling logic that benefit from abundant I/O and on-chip memory.

Unique Advantages

  • Balanced Logic and Memory: Combines approximately 19,000 logic elements with ~1.246 Mbits of embedded RAM to support mid-sized system functions on a single device.
  • High I/O Count: 304 I/Os enable flexible interfacing to peripherals, sensors, and buses without external multiplexing.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C aligns the device to industrial application environments.
  • Compact BGA Package: 484-ball FPBGA (23 × 23 mm) provides a high pin-count solution in a compact footprint for space-constrained boards.
  • Predictable Power Envelope: Defined core supply window (1.14–1.26 V) simplifies power supply design and margin planning.
  • Environmentally Compliant: RoHS compliance helps meet regulatory and sourcing requirements.

Why Choose LFE2M20E-5FN484I?

The LFE2M20E-5FN484I positions itself as a mid-range, industrial-grade FPGA within the Lattice ECP2M family, delivering a practical combination of logic density, on-chip memory, and a high I/O count in a compact 484-ball BGA package. It is suited to designers who need moderate programmable logic capacity, substantial embedded RAM, and the connectivity options afforded by many I/Os while maintaining operation across an extended temperature range.

This device benefits teams seeking a scalable FPGA platform with family-level features documented in the ECP2/M datasheet, enabling reuse of design IP and predictable system integration for industrial and connectivity-focused applications.

If you would like pricing, availability, or a formal quote for LFE2M20E-5FN484I, request a quote or submit an inquiry and our team will respond with the next steps.

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