LFE2M20E-5FN484I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 1,175 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 304 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20E-5FN484I – ECP2M FPGA · 304 I/Os · ~1.246 Mbit RAM · 19,000 logic elements · 484-BBGA
The LFE2M20E-5FN484I is a Lattice ECP2M family Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package. It integrates approximately 19,000 logic elements and roughly 1.246 Mbits of embedded RAM, providing a balance of logic density and on-chip memory for industrial designs.
With 304 user I/Os, a 1.14–1.26 V core supply range, and an industrial operating temperature range of −40 °C to 100 °C, this device addresses applications requiring moderate logic capacity, significant I/O bandwidth, and extended temperature support.
Key Features
- Logic Capacity Approximately 19,000 logic elements for implementing mid-range combinational and sequential logic.
- On-chip Memory Approximately 1.246 Mbits of embedded memory to store buffers, FIFOs and state data directly on the device.
- I/O Density 304 user I/Os to support multiple parallel interfaces, sensor arrays, or mixed-signal front-ends.
- Supply Voltage Core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
- Package & Mounting 484-ball FPBGA (23 × 23 mm) package, surface-mount mounting type for compact board integration.
- Industrial Temperature Grade Specified for operation from −40 °C to 100 °C for deployments in extended-temperature environments.
- Family Capabilities (ECP2/M) Includes the ECP2/M family feature set from the datasheet such as advanced DSP blocks, flexible memory resources, and high-speed SERDES support (as applicable to ECP2M family devices).
- RoHS Compliant Conforms to RoHS environmental requirements.
Typical Applications
- Industrial Control Use for I/O aggregation, protocol bridging, and control logic where extended temperature range and robust I/O count are required.
- Networking & Connectivity Suitable for mid-range communication endpoints and protocol adaptation leveraging the ECP2M family’s high-speed serial and interface capabilities.
- Embedded Processing Acceleration Implement hardware accelerators, DSP preprocessing, and custom state machines using available logic elements and embedded RAM.
- Test & Measurement Ideal for data acquisition front ends and timing-critical sampling logic that benefit from abundant I/O and on-chip memory.
Unique Advantages
- Balanced Logic and Memory: Combines approximately 19,000 logic elements with ~1.246 Mbits of embedded RAM to support mid-sized system functions on a single device.
- High I/O Count: 304 I/Os enable flexible interfacing to peripherals, sensors, and buses without external multiplexing.
- Industrial Reliability: Specified operation from −40 °C to 100 °C aligns the device to industrial application environments.
- Compact BGA Package: 484-ball FPBGA (23 × 23 mm) provides a high pin-count solution in a compact footprint for space-constrained boards.
- Predictable Power Envelope: Defined core supply window (1.14–1.26 V) simplifies power supply design and margin planning.
- Environmentally Compliant: RoHS compliance helps meet regulatory and sourcing requirements.
Why Choose LFE2M20E-5FN484I?
The LFE2M20E-5FN484I positions itself as a mid-range, industrial-grade FPGA within the Lattice ECP2M family, delivering a practical combination of logic density, on-chip memory, and a high I/O count in a compact 484-ball BGA package. It is suited to designers who need moderate programmable logic capacity, substantial embedded RAM, and the connectivity options afforded by many I/Os while maintaining operation across an extended temperature range.
This device benefits teams seeking a scalable FPGA platform with family-level features documented in the ECP2/M datasheet, enabling reuse of design IP and predictable system integration for industrial and connectivity-focused applications.
If you would like pricing, availability, or a formal quote for LFE2M20E-5FN484I, request a quote or submit an inquiry and our team will respond with the next steps.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016