LFE2M20E-6F484I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 913 Available (as of May 20, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 304 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20E-6F484I – ECP2M FPGA, 19,000 Logic Elements, ~1.2 Mbit RAM, 304 I/Os
The LFE2M20E-6F484I is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a high-density logic fabric with embedded memory and a large I/O count in a compact 484-ball BGA package.
Built to industrial-grade specifications, this device delivers approximately 19,000 logic elements, around 1.2 Mbits of on-chip RAM and 304 general-purpose I/Os, making it suitable for industrial applications that require extended temperature operation and high integration.
Key Features
- Core Logic Approximately 19,000 logic elements provide substantial configurable logic resources for mid-range FPGA designs.
- Embedded Memory Approximately 1.2 Mbits of on-chip RAM supports data buffering, state storage and implementation of memory-intensive functions.
- I/O Capacity 304 I/Os accommodate dense connectivity and interface requirements without external expansion.
- Power Supply Operates from a low-voltage core supply range of 1.14 V to 1.26 V to match modern system power domains.
- Package & Mounting 484-ball FBGA (484-BBGA / 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in extended-temperature environments.
- Compliance RoHS-compliant construction for environmental and regulatory alignment.
Unique Advantages
- High integration density: Approximately 19,000 logic elements and on-chip memory reduce the need for external logic and RAM components.
- Extensive I/O: 304 I/Os enable complex interfacing and reduce board-level multiplexing or expansion needs.
- Compact, surface-mount package: 484-BBGA (23×23) provides a small footprint for space-constrained designs.
- Low-voltage core operation: 1.14 V to 1.26 V core supply aligns with modern low-power system rails.
- Industrial-ready thermal range: −40 °C to 100 °C rating supports deployments in temperature-sensitive industrial environments.
- RoHS compliant: Environmentally compliant materials and manufacturing.
Why Choose LFE2M20E-6F484I?
The LFE2M20E-6F484I positions itself as a mid-density FPGA choice that balances logic capacity, embedded memory and a high I/O count in a compact 484-ball BGA package. Its industrial temperature rating and RoHS compliance make it appropriate for designs that require reliable operation across an extended temperature range.
This part is well suited to developers and procurement teams seeking a Lattice Semiconductor FPGA with approximately 19,000 logic elements, about 1.2 Mbits of on-chip RAM and 304 I/Os, all in a surface-mount, industrial-grade package.
Request a quote or submit an inquiry to receive pricing and availability for the LFE2M20E-6F484I.
