LFE2M20E-6F256I

The LFE2M20E-6F256I is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-range programmable logic solution with 19,000 logic elements and approximately 1.246 Mbits of on-chip RAM, packaged in a compact 256-ball BGA.

Designed for industrial-grade applications, this surface-mount FPGA combines substantial logic capacity, embedded memory, and 140 I/O pins while operating from a low-voltage core supply and a wide industrial temperature range.

Key Features

• Logic Capacity  Provides 19,000 logic elements to implement custom digital functions and mid-range system-level logic.
• Embedded Memory  Approximately 1.246 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density  140 I/O pins to connect sensors, peripherals, and external logic interfaces directly to the FPGA fabric.
• Power  Core voltage supply range of 1.14 V to 1.26 V for low-voltage operation.
• Package & Mounting  256-ball FPBGA package (17 × 17 mm) in a surface-mount form factor to support compact board layouts.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting industrial environmental requirements.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Custom Digital Logic  Implement user-defined state machines, protocol conversion, and timing-critical glue logic using 19,000 logic elements.
• Memory-Intensive Functions  Leverage approximately 1.246 Mbits of embedded RAM for buffering, FIFOs, and local data storage in embedded designs.
• I/O-Driven Interfaces  Use 140 I/O pins to interface with sensors, external ADCs/DACs, and peripheral devices in mid-range systems.
• Industrial Embedded Systems  Industrial temperature rating and surface-mount BGA packaging make it suitable for deployed control and automation electronics.

Unique Advantages

• Mid-Range Logic Density:  19,000 logic elements offer a balance of capacity and cost for complex control and signal processing tasks without over-provisioning.
• Integrated On-Chip RAM:  Approximately 1.246 Mbits of RAM reduces the need for external memory for many buffering and temporary storage uses.
• High I/O Count:  140 I/O pins provide flexibility to connect multiple external devices and interfaces directly to the programmable fabric.
• Compact, Manufacturable Package:  256-BGA (17 × 17) surface-mount package supports dense PCB designs and automated assembly processes.
• Industrial Temperature Capability:  Rated from −40 °C to 100 °C for reliability in a wide range of operating environments.
• Regulatory Compliance:  RoHS compliance facilitates integration into modern, environmentally compliant product lines.

Why Choose LFE2M20E-6F256I?

The LFE2M20E-6F256I positions itself as a practical mid-range FPGA option for engineers who need a combination of substantial logic resources, embedded memory, and a high I/O count in a compact industrial-grade package. Its 19,000 logic elements, approximately 1.246 Mbits of on-chip RAM, and 140 I/O pins make it suitable for embedded designs that require on-board processing, interface consolidation, or custom digital control.

With a low-voltage core supply and an operating range from −40 °C to 100 °C, this FPGA is aimed at applications and customers seeking a reliable, RoHS-compliant programmable device from Lattice Semiconductor for production deployments that demand mid-range capacity and industrial temperature operation.

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