LFE2M20SE-5FN484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 186 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 304 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20SE-5FN484C – Lattice ECP2M FPGA, 19,000 Logic Elements, 304 I/O, 484-BBGA
The LFE2M20SE-5FN484C is a field programmable gate array (FPGA) member of the Lattice ECP2M family, delivered in a 484-ball BGA package. It provides a balanced integration of logic, embedded memory and I/O to support mid-density system designs.
With approximately 19,000 logic elements, roughly 1.246 Mbits of on-chip RAM and 304 user I/Os, this commercial-grade, surface-mount device targets applications that require significant logic resources, flexible I/O and compact package integration while operating from a 1.14 V to 1.26 V supply.
Key Features
- Core Logic Approximately 19,000 logic elements to implement medium-density FPGA designs.
- Embedded Memory Total on-chip RAM of 1,246,208 bits (approximately 1.246 Mbits) for implemented buffers, state machines and data storage.
- I/O Capacity & Programmability 304 user I/Os provide broad interface connectivity for peripherals, memory and inter-chip signaling.
- Voltage Supply Operates from a core supply range of 1.14 V to 1.26 V.
- Package & Mounting 484-ball BGA (484-FPBGA, 23 × 23 mm) in a surface-mount form factor for high-density board integration.
- Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS-compliant manufacturing.
- Family Capabilities (Lattice ECP2M) The Lattice ECP2/M family provides advanced architecture options such as high logic density, enhanced DSP building blocks, flexible embedded block RAM and high-speed SERDES (ECP2M family only), as described in the family datasheet.
Typical Applications
- High-speed communications equipment Implement protocol engines and interface logic where mid-density logic and ample I/O are required.
- Networking and connectivity modules Use the device to handle packet processing, bridging and custom buffering in compact form factors.
- Industrial automation (commercial environments) Integrate control logic, sensor aggregation and protocol translation within the commercial temperature range.
- Embedded processing and prototyping Deploy as a platform for custom logic acceleration, hardware prototyping or system glue logic.
Unique Advantages
- Substantial logic capacity: Approximately 19,000 logic elements enable complex state machines, custom datapaths and mid-sized FPGA designs without external logic.
- Significant on-chip RAM: Approximately 1.246 Mbits of embedded memory reduces the need for external SRAM/DDR in many buffering and storage use cases.
- High I/O count in a compact BGA: 304 I/Os in a 484-BBGA (23 × 23 mm) package supports dense connectivity while keeping PCB area efficient.
- Commercial temperature and RoHS compliance: Suitable for commercial applications that require documented operating range and environmental compliance.
- Family-level architecture benefits: As part of the Lattice ECP2M family, device designs can leverage family capabilities such as enhanced DSP blocks and high-speed serial features described in the family datasheet.
Why Choose LFE2M20SE-5FN484C?
This Lattice ECP2M FPGA part offers a practical balance of logic density, embedded memory and I/O for designers building medium-complexity systems that require compact packaging and commercial temperature operation. The device’s combination of approximately 19,000 logic elements, roughly 1.246 Mbits of on-chip RAM and 304 I/Os makes it suitable for applications where integration and board-level space savings matter.
Selecting LFE2M20SE-5FN484C provides access to the Lattice ECP2/M family architecture and documentation, enabling scalable design choices and predictable platform behavior for commercial embedded and communications applications.
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