LFE2M20SE-6F256C

IC FPGA 140 I/O 256FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 140 1246208 19000 256-BGA

Quantity 1,179 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O140Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2375Number of Logic Elements/Cells19000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1246208

Overview of LFE2M20SE-6F256C – ECP2M Field Programmable Gate Array (FPGA), 256-BGA

The LFE2M20SE-6F256C is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a commercial-grade, surface-mount programmable logic solution in a compact 256-ball FPBGA (17×17) package.

With approximately 19,000 logic elements, roughly 1.246 Mbits of embedded memory, and 140 I/Os, this device targets commercial applications that require substantial configurable logic, moderate on-chip RAM, and a dense I/O complement within a small package footprint.

Key Features

  • Core Logic  Approximately 19,000 logic elements to implement custom digital logic and control functions.
  • Embedded Memory  Approximately 1.246 Mbits of on-chip RAM for buffering, state storage, and scratchpad memory.
  • I/O Density  140 user I/O pins suitable for interfacing with peripherals, sensors, and external buses.
  • Power Supply  Operates from a core voltage supply in the range of 1.14 V to 1.26 V.
  • Package & Mounting  Supplier device package: 256-FPBGA (17×17); surface-mount mounting type for compact board integration.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Compact embedded systems  Implement control logic, protocol bridging, or custom interfaces where a high logic count and moderate on-chip memory are required in a small BGA package.
  • I/O-intensive designs  Use the 140 I/Os to connect multiple peripherals, sensors, or external devices while maintaining a compact PCB footprint.
  • Firmware-upgradable logic  Deploy configurable hardware functions for commercial products that benefit from in-field updates or custom logic tuning.

Unique Advantages

  • High logic capacity: Approximately 19,000 logic elements enable complex custom logic and control implementations without external ASICs.
  • On-chip memory: Nearly 1.246 Mbits of embedded RAM supports buffering and local data storage, reducing dependence on external memory.
  • Generous I/O count: 140 I/Os provide flexibility for multiple interfaces and peripheral connections in a single device.
  • Compact, board-friendly package: 256-FPBGA (17×17) surface-mount package balances routing density and PCB real estate for space-constrained designs.
  • Commercial temperature grade: Rated 0 °C to 85 °C for typical commercial deployments.
  • RoHS compliant: Conforms to lead-free assembly and environmental compliance requirements.

Why Choose LFE2M20SE-6F256C?

The LFE2M20SE-6F256C positions itself as a capable commercial-grade FPGA offering a strong mix of logic capacity, embedded memory, and I/O count in a compact 256-FPBGA package. It is suited for designers who need substantial programmable logic and on-chip RAM while maintaining a small board footprint and surface-mount assembly.

Its voltage and temperature ratings make it appropriate for a wide range of commercial embedded systems where configurable hardware, I/O flexibility, and RoHS compliance are important considerations.

Request a quote or submit an inquiry for LFE2M20SE-6F256C to receive pricing and availability information tailored to your project needs.

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