LFE2M20SE-6FN256C

The LFE2M20SE-6FN256C is an ECP2M series field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a balance of reconfigurable logic capacity, on-chip memory and I/O density in a compact ball grid array package for commercial applications.

Key device attributes include 19,000 logic elements, approximately 1.246 Mbits of embedded memory, 140 I/Os, a 256‑BGA (256‑FPBGA 17×17) package, and a low-voltage core supply range of 1.14 V to 1.26 V. The device is RoHS compliant and rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic — 19,000 logic elements provide substantial reconfigurable logic capacity for digital system implementation.
• Embedded Memory — Approximately 1.246 Mbits of on‑chip RAM to support buffering, state storage, and local data processing without immediate dependence on external memory.
• I/O Density — 140 user I/Os offer interface capacity for peripherals, sensors, and external devices.
• Package & Mounting — 256‑BGA package (supplier device package: 256‑FPBGA, 17×17) designed for surface‑mount assembly to minimize board footprint.
• Power — Core voltage supply specified from 1.14 V to 1.26 V for integration with low‑voltage digital domains.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operational range.
• Regulatory — RoHS compliant for compliance with lead‑free manufacturing requirements.

Typical Applications

• Embedded Systems — Use the device's logic density and on‑chip memory to implement custom control logic and peripheral interfaces in commercial embedded designs.
• Interface Bridging — 140 I/Os combined with local memory make the device suitable for protocol conversion and intermediate buffering between subsystems.
• Hardware Acceleration — Deploy the reconfigurable logic and embedded RAM to offload specific compute or data‑path tasks within a larger commercial application.

Unique Advantages

• Reconfigurable Logic Density: 19,000 logic elements enable implementation of complex digital functions without extensive external glue logic.
• Significant On‑Chip Memory: Approximately 1.246 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O Count: 140 I/Os support multiple interfaces and peripherals, simplifying board-level integration.
• Compact BGA Footprint: 256‑BGA / 256‑FPBGA (17×17) provides a high pin count in a space‑efficient form factor for surface‑mount assembly.
• Low‑Voltage Core: 1.14 V–1.26 V core supply supports modern low‑voltage design practices and power budgeting.
• Commercial Reliability: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial deployments.

Why Choose LFE2M20SE-6FN256C?

The LFE2M20SE-6FN256C delivers a pragmatic combination of logic capacity, embedded memory and I/O density in a compact 256‑BGA package for commercial applications. As part of the ECP2M family from Lattice Semiconductor Corporation, this device is suited to designs that require moderate to substantial reconfigurable logic and local memory within a constrained board footprint.

For engineers and procurement teams building commercial electronics, the device offers an efficient integration point for custom digital functions, protocol handling and targeted hardware acceleration, while meeting common manufacturing and environmental requirements.

Request a quote or submit an inquiry to receive pricing and availability information for LFE2M20SE-6FN256C. Provide your quantity and lead-time requirements to get a tailored response.