LFE2M20SE-6FN484I

IC FPGA 304 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA

Quantity 152 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O304Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2375Number of Logic Elements/Cells19000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1246208

Overview of LFE2M20SE-6FN484I – ECP2M Field Programmable Gate Array (FPGA)

The LFE2M20SE-6FN484I is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a balance of logic capacity, on-chip memory and high I/O count in a compact 484-ball BGA package for surface-mount assembly.

Designed for industrial-grade operation, this device provides 19,000 logic elements, approximately 1.246 Mbits of embedded memory, 304 I/O pins, and a low-voltage supply range of 1.14 V to 1.26 V, with guaranteed operation from -40 °C to 100 °C. It is RoHS compliant.

Key Features

  • Core Logic 19,000 logic elements to implement medium-complexity digital designs and custom logic functions.
  • Embedded Memory Approximately 1.246 Mbits of on-chip RAM for buffering, packet memory or local data storage.
  • High I/O Density 304 user I/O pins suitable for multi-interface designs and extensive external connectivity.
  • Package & Mounting 484-ball body‑first BGA (484‑BBGA / 484‑FPBGA 23×23) in a surface-mount form factor for high-density board layouts.
  • Power Low-voltage core supply range of 1.14 V to 1.26 V to match modern low-voltage system domains.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet deployed-environment requirements.
  • Compliance RoHS compliant for environmentally conscious designs and manufacturing.

Unique Advantages

  • High integration in a compact package: 19,000 logic elements and 304 I/Os in a 484-ball BGA reduce board-level component count while preserving routing density.
  • On-chip memory capacity: Approximately 1.246 Mbits of embedded RAM supports local buffering and data handling without immediate external memory.
  • Industrial operating range: Specified -40 °C to 100 °C supports deployment in a wide range of environmental conditions.
  • Low-voltage core compatibility: 1.14 V–1.26 V supply enables integration with modern low-voltage power domains.
  • Surface-mount BGA form factor: 484‑FPBGA (23×23) package optimizes PCB real estate for compact system designs.
  • Regulatory compliance: RoHS compliance simplifies adherence to environmental requirements.

Why Choose LFE2M20SE-6FN484I?

The LFE2M20SE-6FN484I is positioned for designs that require a balanced combination of logic resources, embedded memory and high I/O count in a single, industrial-grade FPGA package. Its specification set supports integration into systems needing substantial on-chip resources while maintaining a compact board footprint.

Backed by Lattice Semiconductor Corporation, this device is suitable for engineers and procurement teams seeking a mid-density FPGA with defined voltage and temperature performance characteristics, offering predictable integration into industrial applications and production environments.

Request a quote or submit an inquiry to obtain pricing and availability for LFE2M20SE-6FN484I.

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