LFE2M20SE-7FN484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA |
|---|---|
| Quantity | 478 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 304 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2375 | Number of Logic Elements/Cells | 19000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1246208 |
Overview of LFE2M20SE-7FN484C – ECP2M Field Programmable Gate Array (FPGA) IC 304 1246208 19000 484-BBGA
The LFE2M20SE-7FN484C is a field programmable gate array (FPGA) from Lattice Semiconductor's ECP2M family, delivered in a 484-ball BBGA package. It provides a balance of programmable logic capacity, embedded memory, and a high I/O count suitable for compact, I/O‑dense commercial designs.
With approximately 19,000 logic elements, about 1.25 Mbits of on-chip RAM, and 304 I/Os, this device targets applications that require mid-range logic integration, significant local memory, and broad external connectivity while operating within standard commercial temperature and voltage ranges.
Key Features
- Core Logic Approximately 19,000 logic elements to implement combinational and sequential logic for mid-range FPGA designs.
- Embedded Memory Approximately 1.25 Mbits of on-chip RAM for data buffering, FIFOs, and local storage without external memory.
- I/O Density 304 I/O pins support a wide range of external interfaces and parallel connections for I/O‑heavy designs.
- Power Operates from a supply range of 1.14 V to 1.26 V, enabling designs constrained to low-voltage core domains.
- Package & Mounting 484-ball BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board layouts.
- Temperature & Grade Commercial grade device specified for 0 °C to 85 °C operation for standard temperature environments.
- Regulatory RoHS compliant, supporting environmentally conscious product builds.
Typical Applications
- I/O‑Dense Embedded Systems High I/O count supports designs that aggregate multiple sensors, peripherals, or parallel interfaces on a single FPGA.
- Memory‑Assisted Logic Approximately 1.25 Mbits of embedded RAM enables local buffering and data processing without relying solely on external memory.
- Interface Bridging and Glue Logic Use the device to implement protocol translation, bus bridging, and custom interfacing between subsystems.
- Compact System Integration 484-BBGA package and surface-mount mounting make it suitable for space-constrained PCBs where mid-range programmable capacity is required.
Unique Advantages
- High Logic Capacity: Approximately 19,000 logic elements provide substantial programmable resources for mid-range designs, reducing need for multiple devices.
- Generous On‑Chip Memory: About 1.25 Mbits of embedded RAM supports local data buffering and real-time processing without immediate external memory.
- Extensive External Connectivity: 304 I/Os accommodate a broad set of peripherals and parallel interfaces, simplifying board-level connectivity.
- Compact Packaging: 484‑BBGA (23×23) enables a small PCB footprint while maintaining signal density for complex designs.
- Low‑Voltage Core Operation: 1.14 V to 1.26 V supply range aligns with low-voltage system domains to help manage power architecture.
- RoHS Compliant: Environmentally compliant manufacturing supports regulatory and sustainability goals.
Why Choose LFE2M20SE-7FN484C?
The LFE2M20SE-7FN484C positions itself as a capable mid-range FPGA option that combines substantial logic resources, significant embedded memory, and a high number of I/Os in a compact, surface-mount BBGA package. Its commercial-grade rating and defined operating voltage range make it suitable for a wide range of standard temperature embedded applications.
This device is well suited to engineers and teams designing compact, I/O-heavy systems that need on-chip memory and flexible programmable logic. The combination of integration, connectivity, and RoHS compliance supports streamlined BOMs and environmentally conscious product builds.
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