LFE2M35E-5F484C

IC FPGA 303 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA

Quantity 71 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O303Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells34000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2151424

Overview of LFE2M35E-5F484C – ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA

The LFE2M35E-5F484C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2M family. It provides a programmable logic fabric with 34,000 logic elements and approximately 2.15 Mbits of embedded memory, delivering on-chip resources for complex logic and buffering needs.

With 303 I/O pins, a 484-ball BGA package, a low-voltage core supply range of 1.14 V–1.26 V, and commercial temperature grading (0 °C to 85 °C), this device is suited to designs that require significant logic density, embedded RAM, and high I/O count in a surface-mount BGA footprint.

Key Features

  • Logic Capacity 34,000 logic elements provide the primary programmable fabric for implementing custom logic functions; the device includes 4,250 logic array blocks (as listed in the product data).
  • Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support FIFOs, buffers, and data storage without external memory.
  • High I/O Count 303 general-purpose I/O pins for interfacing to peripherals, buses, and external devices.
  • Power Core voltage supply range of 1.14 V to 1.26 V to match system power rails and enable predictable core operation.
  • Package & Mounting 484-ball BGA package (supplier package: 484-FPBGA, 23 × 23) designed for surface-mount assembly in compact layouts.
  • Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
  • Compliance RoHS-compliant construction for regulatory and manufacturing alignment.

Unique Advantages

  • Substantial on-chip resources: 34,000 logic elements combined with approximately 2.15 Mbits of embedded RAM reduce dependence on external logic and memory components.
  • High I/O integration: 303 I/O pins enable direct connection to multiple peripherals and buses, simplifying board-level routing and BOM.
  • Compact BGA footprint: The 484-ball BGA (23 × 23) package provides a high-density solution for space-constrained PCBs while supporting surface-mount assembly.
  • Low-voltage core compatibility: The 1.14 V–1.26 V supply range supports designs targeting lower core voltages for modern system power architectures.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial embedded applications.
  • RoHS compliant: Environmental compliance helps streamline manufacturing and regulatory alignment.

Why Choose LFE2M35E-5F484C?

The LFE2M35E-5F484C balances significant programmable logic capacity, embedded memory, and a high I/O count in a compact 484-BBGA package, making it a practical choice for designs that require on-chip resources and dense connectivity. Its low-voltage core and commercial temperature rating make it appropriate for a wide range of standard embedded applications where these specific capabilities are required.

Engineers and buyers will find the device’s combination of logic elements, embedded RAM, I/O density, and RoHS compliance useful when optimizing board area, reducing external components, and aligning with commercial production requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE2M35E-5F484C.

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