LFE2M35E-5FN256I

The LFE2M35E-5FN256I is a Field Programmable Gate Array (FPGA) IC from the ECP2M family, delivering 34,000 logic elements and approximately 2.15 Mbits of embedded memory. Packaged in a 256-BGA (256-FPBGA, 17×17) surface-mount package and rated for industrial operation, it is intended for designs that require moderate logic capacity, on-chip RAM, and a compact BGA footprint.

Key Features

• Core Logic  34,000 logic elements provide substantial programmable logic resources for custom digital functions and glue logic.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage within the FPGA fabric.
• I/O  140 user I/O pins for interfacing with peripherals, sensors, and external devices.
• Package & Mounting  256-BGA package (256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Power  Core voltage supply of 1.14 V to 1.26 V, supporting low-voltage FPGA core operation.
• Temperature Range  Industrial operating range from -40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS-compliant construction to meet common environmental requirements.

Typical Applications

• Industrial Control  Implement custom control logic and I/O aggregation for factory automation and process equipment within an industrial temperature range.
• Embedded Systems  Provide programmable logic and local memory for embedded processing tasks and hardware acceleration.
• Prototyping & Development  Use the ECP2M device to validate digital designs and iterate hardware implementations with substantial on-chip resources.

Unique Advantages

• Substantial Logic Capacity: 34,000 logic elements enable implementation of complex digital functions without immediate need for external logic devices.
• Meaningful On‑chip Memory: Approximately 2.15 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path requirements.
• Industrial Temperature Rating: -40 °C to 100 °C operation supports deployment in thermally challenging industrial environments.
• Compact BGA Package: 256-FPBGA (17×17) provides a high-density package option for space-constrained boards.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage FPGA power domains to help manage overall system power.
• RoHS Compliant: Environmentally compliant materials simplify adherence to regulatory requirements.

Why Choose LFE2M35E-5FN256I?

The LFE2M35E-5FN256I positions itself as a balanced, industrial-grade FPGA option that combines a sizable logic fabric with meaningful embedded memory and a compact 256-BGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for applications where environmental robustness and regulatory compliance matter.

This device is well suited to designers seeking a programmable, on-chip solution for custom digital logic, embedded system augmentation, and industrial control tasks—offering scalability and integration that can simplify board-level design and reduce external component count.

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