LFE2M35E-5FN672C

The LFE2M35E-5FN672C is a commercial‑grade FPGA in the Lattice ECP2/M family, supplied in a 672‑ball BGA package. It combines a dense logic fabric with significant embedded RAM and a large I/O count to address mid‑range system integration needs where flexible I/O and on‑chip memory are important.

Designed for system and communications applications, the device pairs approximately 34,000 logic elements with roughly 2.151 Mbits of embedded memory and 410 available I/Os, while operating from a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity Approximately 34,000 logic elements to implement medium‑complexity digital functions and state machines.
• Embedded Memory Approximately 2.151 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density and Flexibility 410 I/O pins available in a 672‑ball package to support wide peripheral and interface connectivity.
• Package and Mounting 672‑BBGA (supplier package: 672‑FPBGA, 27×27 mm) in a surface‑mount form factor for compact board designs.
• Power Supply Core voltage supply range 1.14 V to 1.26 V for system power budgeting and regulator selection.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
• Family Capabilities (Lattice ECP2/M) Family‑level features include options such as embedded SERDES for high‑speed serial links, enhanced sysDSP blocks for multiply‑accumulate operations, flexible embedded block RAM, and on‑chip PLL/DLL clock management (as described in the Lattice ECP2/M family data sheet).

Typical Applications

• Networking & Telecom interfaces Use the device where dense logic and the family’s SERDES and I/O options support protocols and packet processing at board and module level.
• Embedded system control Implement control, glue logic, and state machines that require significant I/O and local RAM for buffering.
• Data buffering and bridging Leverage on‑chip memory and abundant I/Os for protocol conversion, buffering, and intermediate data handling.
• High‑speed peripheral interfaces Deploy in designs that need flexible I/O signaling and clocking resources for ADC/DAC interfaces or multi‑lane links.

Unique Advantages

• High integration in a compact package: 34,000 logic elements and 410 I/Os in a 27×27 mm 672‑ball BGA reduce board area and BOM complexity.
• Substantial on‑chip memory: Approximately 2.151 Mbits of embedded RAM supports local buffering and data‑path acceleration without immediate external memory.
• Flexible power window: Narrow core supply range (1.14 V–1.26 V) simplifies core regulator selection and power sequencing.
• Commercial availability and compliance: Commercial grade device with RoHS compliance for mainstream electronics production.
• Family‑level DSP and serial capabilities: Access to ECP2/M family features—such as sysDSP blocks, PLL/DLL clock management, and embedded SERDES—enables scalable design reuse and system‑level functionality (per the Lattice ECP2/M family data sheet).

Why Choose LFE2M35E-5FN672C?

The LFE2M35E-5FN672C positions itself as a mid‑range FPGA option that balances logic capacity, embedded memory, and extensive I/O in a compact surface‑mount BGA. It is suited to engineers building systems that require significant local buffering, flexible I/O connectivity, and the architectural capabilities described for the Lattice ECP2/M family.

This device is appropriate for development and production in commercial applications where the combination of roughly 34,000 logic elements, ~2.151 Mbits of embedded RAM, and 410 I/Os delivers a practical blend of performance and integration while leveraging the broader ECP2/M family feature set for clocking, DSP, and serial link options.

Request a quote or submit an inquiry to receive pricing, lead‑time information, and support for integrating the LFE2M35E-5FN672C into your next design.