LFE2M35E-5FN256C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA |
|---|---|
| Quantity | 47 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-5FN256C – ECP2M FPGA, 34,000 Logic Elements, 256‑BGA
The LFE2M35E-5FN256C is an ECP2M field programmable gate array (FPGA) from Lattice Semiconductor Corporation supplied in a 256‑ball BGA package. It provides a high-density programmable logic fabric with 34,000 logic elements, substantial on‑chip RAM and flexible I/O in a commercial‑grade, surface‑mount form factor.
Designed for systems that require embedded memory, configurable logic and substantial I/O count, this device balances integration and power efficiency within a 0 °C to 85 °C operating range and a 1.14 V to 1.26 V core supply window.
Key Features
- Core Capacity 34,000 logic elements for implementing complex digital functions and custom logic architectures.
- Embedded Memory Approximately 2.15 Mbits of on‑chip RAM to support buffering, FIFOs and memory‑centric logic without external RAM.
- I/O Resources 140 I/O pins to support multiple interfaces and external device connections in a single device.
- Package & Mounting 256‑ball FPBGA (17 × 17) package in a surface‑mount configuration for compact board designs.
- Power Core voltage supply range from 1.14 V to 1.26 V to match system power rails and regulator choices.
- Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for environmentally conscious assembly and regulatory alignment.
Unique Advantages
- High logic density: 34,000 logic elements enable complex signal processing and control functions on a single device, reducing the need for multiple discrete ICs.
- Significant embedded memory: Approximately 2.15 Mbits of on‑chip RAM help minimize external memory requirements and simplify board layout.
- Generous I/O count: 140 I/O pins support diverse peripheral and interface requirements without signal multiplexing compromises.
- Compact BGA package: 256‑FPBGA (17 × 17) delivers high pin density in a compact footprint for space‑constrained designs.
- Commercial temperature and RoHS compliance: Clear operating range and environmental compliance simplify qualification for mainstream embedded products.
Why Choose LFE2M35E-5FN256C?
The LFE2M35E-5FN256C positions itself as a capable, commercially graded FPGA option for designs that require a balance of programmable logic density, embedded memory and a healthy I/O complement in a compact BGA package. Its combination of 34,000 logic elements and approximately 2.15 Mbits of on‑chip RAM helps reduce system BOM and PCB complexity by containing more functionality on‑chip.
This device is suitable for engineers and product teams looking for a reliable, RoHS‑compliant FPGA platform with explicit supply and temperature requirements noted for system integration. Its package and electrical specifications support compact, surface‑mount board designs where integration and predictable operating margins matter.
Request a quote or submit your specifications today to get pricing and availability for the LFE2M35E-5FN256C. Our team will respond with a tailored quote and supply information.
