LFE2M35E-5F484I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA |
|---|---|
| Quantity | 802 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 303 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-5F484I – ECP2M Field Programmable Gate Array (FPGA), 484-BBGA
The LFE2M35E-5F484I is an ECP2M family Field Programmable Gate Array (FPGA) supplied in a 484-ball BGA package. It provides a balance of programmable logic capacity, embedded memory, and a high I/O count in a surface-mount form factor intended for industrial applications.
Key device attributes include approximately 34,000 logic elements, roughly 2.15 Mbits of on-chip RAM, 303 user I/Os, a narrow core voltage supply range of 1.14 V to 1.26 V, and an industrial operating temperature range of –40 °C to 100 °C.
Key Features
- FPGA Core ECP2M Field Programmable Gate Array device offering programmable logic for custom digital functions.
- Logic Capacity Approximately 34,000 logic elements to implement medium-density logic designs.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
- High I/O Count 303 user I/Os to support multiple parallel interfaces and signal routing requirements.
- Power Core voltage supply range of 1.14 V to 1.26 V for defined low-voltage operation.
- Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount format for compact board integration.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C and specified as Industrial grade.
- Standards Compliance RoHS compliant.
Unique Advantages
- Substantial Logic Density: Approximately 34,000 logic elements enable implementation of complex custom logic and state machines without external glue logic.
- Significant On-Chip Memory: About 2.15 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
- Generous I/O Resources: 303 user I/Os provide flexibility for parallel interfaces, board-level routing, and multiple peripheral connections.
- Industrial Temperature Capability: Rated from –40 °C to 100 °C to support designs targeting industrial operating environments.
- Compact BGA Package: 484-BBGA (484-FPBGA, 23 × 23) surface-mount package allows dense PCB integration while maintaining a high pin count.
- Defined Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) supports consistent power planning and supply design.
Why Choose LFE2M35E-5F484I?
The LFE2M35E-5F484I is positioned for applications that require a mid-to-high logic density FPGA with on-chip memory and a large I/O complement in an industrial-temperature, surface-mount BGA package. Its combination of approximately 34,000 logic elements, roughly 2.15 Mbits of embedded RAM, and 303 I/Os makes it suitable for designs that need integrated programmable logic, local memory, and extensive connectivity while meeting industrial temperature requirements.
With RoHS compliance and a defined core voltage range, the device provides clear, verifiable specifications for engineers and procurement teams evaluating programmable logic solutions for industrial applications.
Request a quote or submit an inquiry to receive pricing and availability for the LFE2M35E-5F484I. Our team can provide a tailored response for your project needs.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016