LFE2M35E-5F484I

IC FPGA 303 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA

Quantity 802 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O303Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells34000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2151424

Overview of LFE2M35E-5F484I – ECP2M Field Programmable Gate Array (FPGA), 484-BBGA

The LFE2M35E-5F484I is an ECP2M family Field Programmable Gate Array (FPGA) supplied in a 484-ball BGA package. It provides a balance of programmable logic capacity, embedded memory, and a high I/O count in a surface-mount form factor intended for industrial applications.

Key device attributes include approximately 34,000 logic elements, roughly 2.15 Mbits of on-chip RAM, 303 user I/Os, a narrow core voltage supply range of 1.14 V to 1.26 V, and an industrial operating temperature range of –40 °C to 100 °C.

Key Features

  • FPGA Core ECP2M Field Programmable Gate Array device offering programmable logic for custom digital functions.
  • Logic Capacity Approximately 34,000 logic elements to implement medium-density logic designs.
  • Embedded Memory Approximately 2.15 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • High I/O Count 303 user I/Os to support multiple parallel interfaces and signal routing requirements.
  • Power Core voltage supply range of 1.14 V to 1.26 V for defined low-voltage operation.
  • Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23 × 23 mm) in a surface-mount format for compact board integration.
  • Industrial Temperature Range Rated for operation from –40 °C to 100 °C and specified as Industrial grade.
  • Standards Compliance RoHS compliant.

Unique Advantages

  • Substantial Logic Density: Approximately 34,000 logic elements enable implementation of complex custom logic and state machines without external glue logic.
  • Significant On-Chip Memory: About 2.15 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
  • Generous I/O Resources: 303 user I/Os provide flexibility for parallel interfaces, board-level routing, and multiple peripheral connections.
  • Industrial Temperature Capability: Rated from –40 °C to 100 °C to support designs targeting industrial operating environments.
  • Compact BGA Package: 484-BBGA (484-FPBGA, 23 × 23) surface-mount package allows dense PCB integration while maintaining a high pin count.
  • Defined Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) supports consistent power planning and supply design.

Why Choose LFE2M35E-5F484I?

The LFE2M35E-5F484I is positioned for applications that require a mid-to-high logic density FPGA with on-chip memory and a large I/O complement in an industrial-temperature, surface-mount BGA package. Its combination of approximately 34,000 logic elements, roughly 2.15 Mbits of embedded RAM, and 303 I/Os makes it suitable for designs that need integrated programmable logic, local memory, and extensive connectivity while meeting industrial temperature requirements.

With RoHS compliance and a defined core voltage range, the device provides clear, verifiable specifications for engineers and procurement teams evaluating programmable logic solutions for industrial applications.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2M35E-5F484I. Our team can provide a tailored response for your project needs.

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