LFE2M35E-5F672I

The LFE2M35E-5F672I is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines a substantial logic resource set with on-chip RAM and a high I/O count to address demanding embedded and industrial designs.

Designed for industrial-grade operation, this device provides 34,000 logic elements, approximately 2.15 Mbits of on‑chip RAM, and 410 I/Os in a 672‑ball BGA package, making it suitable for applications that require dense logic, flexible interfacing, and a wide operating temperature range.

Key Features

• Core Logic — 34,000 logic elements provide a sizable programmable fabric for glue logic, custom accelerators, and control functions.
• On‑chip Memory — Approximately 2.15 Mbits of total RAM bits available for buffering, state storage, and intermediate data processing.
• I/O Density — 410 user I/O pins enable complex multi‑interface designs and high‑channel connectivity directly from the FPGA.
• Supply Voltage — Operates from 1.14 V to 1.26 V, defining the device core power domain for system power planning.
• Package & Mounting — 672‑BBGA package (supplier device package: 672‑FPBGA, 27×27) with surface‑mount mounting for compact board layouts.
• Industrial Grade — Specified operating temperature range of −40 °C to 100 °C for industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free manufacturing and assembly.

Typical Applications

• Industrial Control & Automation — Use the device’s industrial temperature rating, high logic count, and abundant I/Os for PLCs, motor control logic, and sensor aggregation.
• Interface Bridging and I/O Expansion — 410 I/Os enable protocol translation, bus bridging, and high‑density front‑end interfacing between subsystems.
• Embedded System Integration — Leverage the logic resources and on‑chip RAM for custom peripherals, data buffering, and control path offload in embedded platforms.
• Prototyping and Development — Provides a flexible hardware platform for validating complex logic and I/O schemes prior to production designs.

Unique Advantages

• Balanced Resource Mix: The combination of 34,000 logic elements and ~2.15 Mbits of RAM supports diverse functions from glue logic to moderate data buffering without external memory.
• High Connectivity: 410 I/Os allow consolidation of multiple interfaces and sensors onto a single device, simplifying board-level integration.
• Industrial Reliability: Specified for −40 °C to 100 °C operation, enabling deployment in temperature-challenging industrial environments.
• Compact, Surface-Mount Package: The 672‑ball BGA (672‑FPBGA, 27×27) supports high pin density in a compact footprint for space-constrained designs.
• RoHS Compliance: Meets lead‑free manufacturing requirements, easing integration into modern production processes.

Why Choose LFE2M35E-5F672I?

The LFE2M35E-5F672I is positioned for designers seeking a well‑balanced FPGA platform with substantial logic capacity, meaningful on‑chip memory, and a high I/O count in an industrial‑rated device. Its feature set supports consolidation of control, interfacing, and buffering functions into a single chip, reducing board complexity and component count.

This device is a practical choice for engineering teams developing industrial automation, high‑connectivity embedded systems, and prototype platforms that require robust temperature tolerance and a compact BGA footprint. Its specification set supports scalable designs where integration and reliable operation are primary concerns.

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