LFE2M35E-5FN484I

The LFE2M35E-5FN484I is an ECP2M-family FPGA optimized for system integration and high-performance I/O and signal processing tasks. This surface-mount, industrial-grade device combines approximately 34,000 logic elements, about 2.15 Mbits of embedded memory and 303 I/Os in a compact 484-ball BGA (23 × 23 mm) package.

Designed for communications, DSP and embedded systems, the device leverages family-level features such as embedded SERDES, advanced DSP blocks and flexible programmable I/O to address demanding interface and data-processing applications while operating across a wide industrial temperature range.

Key Features

• Core Logic  Approximately 34,000 logic elements for implementing complex FPGA functions and custom logic partitions.
• On-chip Memory  Total RAM of 2,151,424 bits (approximately 2.15 Mbits) of embedded memory to support buffering, lookup tables and state storage.
• I/O Density and Flexibility  303 I/Os with programmable sysI/O buffer support for a wide range of standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL and others listed for the family) enabling multiple interface options on the same device.
• High-speed SERDES (Family Feature)  LatticeECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps and multi-channel configurations suitable for serial protocols used in communications systems.
• DSP and Timing Resources  Family-level sysDSP blocks and integrated PLL/DLL clock resources support multiply-accumulate operations and flexible clock management for real-time signal processing designs.
• Power and Package  Core supply voltage range 1.14 V to 1.26 V. Device is offered in a 484-ball fpBGA (23 × 23 mm) package, surface-mount.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-speed communications  Implement protocol processing and interface bridging for Ethernet, PCI Express and other serial protocols supported across the ECP2M family.
• Serial transceivers and backplane links  Leverage family SERDES capability for multi-gigabit chip-to-chip and small form-factor backplane connectivity.
• DSP and signal processing  Use embedded memory and sysDSP resources for real-time multiply/accumulate tasks, filtering and data-path acceleration.
• Embedded system integration  Consolidate glue logic, peripherals and custom accelerators into a single FPGA to reduce BOM and simplify board-level design.

Unique Advantages

• High integration density: Combine ~34,000 logic elements and ~2.15 Mbits of on-chip memory to implement large, consolidated designs on a single device.
• Flexible I/O mix: 303 I/Os and programmable buffers let you implement multiple interface standards without external level-shifting components.
• Designed for high-speed serial links: Family-level embedded SERDES support enables a range of serial protocols and multi-channel configurations.
• Industrial robustness: −40 °C to 100 °C operating range and surface-mount fpBGA packaging for industrial applications.
• Low-voltage core: Narrow core supply window (1.14 V–1.26 V) aligns with modern low-power design practices.
• Ecosystem support: Family support by Lattice Diamond design software aids implementation and bring-up of complex designs.

Why Choose LFE2M35E-5FN484I?

The LFE2M35E-5FN484I positions itself as a compact, industrial-grade FPGA option for designs that require substantial logic capacity, a significant amount of embedded memory and a high count of flexible I/Os. Its placement in the LatticeECP2M family brings access to family-level capabilities such as embedded SERDES, DSP resources and programmable I/O options that simplify system-level integration.

This device is well suited for engineers building communications systems, high-speed interface modules, and embedded processing platforms that require deterministic operation across industrial temperature ranges and benefit from a consolidated FPGA-based implementation.

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