LFE2M35E-6F256C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA |
|---|---|
| Quantity | 131 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-6F256C – ECP2M FPGA, 34,000 logic elements, ~2.15 Mbits RAM, 256-FPBGA
The LFE2M35E-6F256C is a field programmable gate array (FPGA) from Lattice Semiconductor’s ECP2M family. It integrates 34,000 logic elements and approximately 2.15 Mbits of embedded memory with 140 user I/Os in a 256‑FBPGA (17×17) surface‑mount package.
Designed for commercial‑grade applications, this device operates from a 1.14 V to 1.26 V supply and supports an ambient operating range of 0 °C to 85 °C. It is RoHS compliant and packaged for compact board integration.
Key Features
- Logic Capacity Provides 34,000 logic elements to implement medium‑density programmable logic and custom digital functions.
- Embedded Memory Approximately 2.15 Mbits of on‑chip RAM to support data buffering, FIFOs, and local storage for accelerated processing.
- I/O Resources 140 user I/Os for interfacing with peripherals, sensors, and external devices.
- Power Operates from a 1.14 V to 1.26 V core supply, enabling integration into low‑voltage system designs.
- Package & Mounting 256‑FBPGA (17×17) package, surface‑mount for compact PCB layouts and high‑density board assembly.
- Temperature & Grade Commercial grade device specified for 0 °C to 85 °C ambient operation.
- Environmental Compliance RoHS compliant for environmental and regulatory alignment.
Unique Advantages
- Balanced logic and memory integration: 34,000 logic elements combined with ~2.15 Mbits of embedded RAM provide a versatile resource mix for mid‑range programmable designs.
- Generous I/O count: 140 I/Os allow flexible peripheral and bus connectivity without immediate need for external I/O expanders.
- Compact surface‑mount packaging: The 256‑FBPGA (17×17) package supports high‑density board layouts while keeping component count low.
- Low‑voltage core operation: 1.14 V to 1.26 V supply range enables integration into power‑sensitive systems that prioritize reduced core power consumption.
- Commercial temperature suitability: Designed for standard commercial environments (0 °C to 85 °C), aligning with a wide range of general‑purpose electronic applications.
- RoHS compliant: Meets common environmental requirements for modern electronic products.
Why Choose LFE2M35E-6F256C?
The LFE2M35E-6F256C positions itself as a mid‑density FPGA option that combines substantial logic capacity, embedded memory, and a high I/O count in a compact 256‑FBPGA surface‑mount package. Its low‑voltage core supply and commercial temperature rating make it suitable for a broad set of standard electronic designs requiring programmable logic and on‑chip memory.
Engineers and procurement teams seeking a RoHS‑compliant, commercially graded FPGA with a clear balance of resources and package density will find this part appropriate for applications that need moderate programmable logic, significant embedded RAM, and flexible I/O in a single device.
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