LFE2M35E-6F484I

The LFE2M35E-6F484I is an ECP2M Field Programmable Gate Array (FPGA) IC manufactured by Lattice Semiconductor Corporation. It delivers a balance of on-chip resources and I/O density in a compact 484‑ball BGA package for industrial-grade applications.

Key device characteristics include 34,000 logic elements, approximately 2.15 Mbits of embedded memory, 303 I/Os, a 1.14–1.26 V supply range, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity 34,000 logic elements provide substantial programmable logic resources for custom digital designs.
• Embedded Memory Approximately 2.15 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
• I/O Density 303 general‑purpose I/Os to accommodate a wide range of parallel interfaces and signal connections.
• Package & Mounting 484‑BBGA (supplier package: 484‑FPBGA, 23×23) in a surface‑mount form factor for space‑efficient board integration.
• Power Low‑voltage operation with a supply range of 1.14 V to 1.26 V to match modern low‑voltage system domains.
• Industrial Temperature Grade Rated for −40 °C to 100 °C, suitable for industrial operating environments.
• RoHS Compliant Meets RoHS requirements for environmentally conscious designs.

Typical Applications

• Industrial Automation Use the industrial temperature rating and high I/O count for sensor interfacing, control logic, and machine‑level coordination.
• Embedded Systems Deploy programmable logic and on‑chip memory to implement custom peripherals, glue logic, and real‑time processing blocks.
• Communications Interfaces Leverage abundant I/Os and logic elements to implement protocol handling, parallel interfaces, and custom data paths.

Unique Advantages

• Substantial Logic Resources: 34,000 logic elements enable complex custom logic implementations without immediate external ASIC support.
• Significant On‑Chip Memory: Approximately 2.15 Mbits of RAM reduces reliance on external memory for many buffering and state storage needs.
• High I/O Count: 303 I/Os allow extensive connectivity to sensors, actuators, and interface transceivers, simplifying board routing and BOM.
• Industrial Reliability: Rated from −40 °C to 100 °C and specified as industrial grade for deployment in harsher environments.
• Compact BGA Footprint: 484‑BBGA (23×23) package provides a high‑density solution for space‑constrained PCBs.
• RoHS Compliance: Supports regulatory requirements for lead‑free manufacturing and assembly.

Why Choose LFE2M35E-6F484I?

The LFE2M35E-6F484I positions itself as a versatile industrial‑grade FPGA offering a blend of logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its supply voltage window and operating temperature range make it suitable for designs that require low‑voltage operation and extended temperature tolerance.

This device is suited to engineers and procurement teams designing industrial control, embedded processing, or communications interface solutions that need programmable, field‑replaceable logic with substantial on‑chip resources and a compact footprint.

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