LFE2M35E-6FN256C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA |
|---|---|
| Quantity | 148 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-6FN256C – ECP2M FPGA, 34,000 Logic Elements, 256-BGA
The LFE2M35E-6FN256C is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 256-BGA package and intended for commercial-grade applications. It provides a balanced mix of programmable logic, embedded memory, and I/O resources for compact, low-voltage designs.
Key Features
- Core Logic 34,000 logic elements for implementing custom digital functions and control logic.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
- I/O Capacity 140 general-purpose I/O pins to interface with peripherals, sensors, and external components.
- Power Low-voltage supply range: 1.14 V to 1.26 V for power-sensitive designs.
- Package & Mounting 256-BGA package, supplied as 256-FPBGA (17×17), surface-mount ready for compact PCB layouts.
- Operating Conditions Commercial operating temperature range: 0 °C to 85 °C; specified as commercial grade.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High integration: 34,000 logic elements combined with ~2.15 Mbits of embedded memory reduce the need for external logic and memory components, simplifying BOM and board routing.
- Ample I/O for system interfacing: 140 I/O pins allow direct connection to a wide range of external devices and subsystems.
- Low-voltage operation: Narrow supply range (1.14 V–1.26 V) supports power-optimized architectures and consistent voltage planning.
- Compact, surface-mount package: 256-FPBGA (17×17) footprint helps save PCB area while supporting dense designs.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation, suitable for standard commercial environments and deployments.
- RoHS compliant: Meets standard environmental requirements for modern electronics manufacturing.
Why Choose LFE2M35E-6FN256C?
The LFE2M35E-6FN256C offers a compact, low-voltage FPGA solution with 34,000 logic elements, substantial embedded memory, and 140 I/Os in a 256-BGA package—well suited for commercial designs that need programmable logic density and flexible interfacing. As a member of the ECP2M family from Lattice Semiconductor Corporation, it provides a clear option for teams seeking a commercially rated FPGA with on-chip memory and a compact package footprint.
Engineers and procurement teams will find this device appropriate for projects requiring a combination of programmable logic, embedded RAM, and a high I/O count within standard commercial thermal limits, delivered in a RoHS-compliant surface-mount package.
Request a quote or submit an inquiry to get pricing and availability for the LFE2M35E-6FN256C.
