LFE2M35E-6FN484I

The LFE2M35E-6FN484I is an ECP2M series FPGA providing a balance of programmable logic density, on-chip memory, and I/O capability for industrial applications. Built for surface-mount deployment in a compact 484-ball BGA package, this device targets designs that require substantial logic capacity, abundant I/O, and operation across an extended temperature range.

Key Features

• Core Logic — Provides 34,000 logic elements to implement complex control, data-path, and glue-logic functions.
• Embedded Memory — Contains approximately 2.15 Mbits of total on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Count — 303 user I/Os for broad peripheral interfacing and flexible system integration.
• Power Supply — Core supply operating range from 1.14 V to 1.26 V to match system power domains.
• Package & Mounting — Surface-mount 484-BBGA package in a 484-FPBGA (23×23 mm) footprint for dense board layouts.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh-environment deployments.
• Regulatory Compliance — RoHS compliant to support environmentally conscious manufacturing and assembly.

Typical Applications

• Industrial Control and Automation — Use the device’s industrial temperature rating and large I/O count for motor control, sensor aggregation, and factory automation interfaces.
• Communications and Networking — Leverage abundant logic elements and on-chip RAM for protocol handling, packet processing, and interface bridging.
• Embedded Systems and Prototyping — Implement custom peripherals, timing-critical glue logic, and data-path accelerators using the device’s programmable fabric and memory.

Unique Advantages

• High Logic Density: 34,000 logic elements enable integration of complex functions that reduce external ASIC or MCU dependencies.
• Substantial On-Chip Memory: Approximately 2.15 Mbits of embedded RAM supports local buffering and state storage, simplifying board-level memory requirements.
• Extensive I/O Connectivity: 303 I/Os provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count subsystems.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and specified as industrial grade for durability in demanding environments.
• Compact BGA Package: 484-ball FPBGA (23×23 mm) package minimizes PCB area while supporting dense routing and high pin count.
• RoHS Compliant: Meets common environmental requirements to aid regulatory and supply-chain compliance.

Why Choose LFE2M35E-6FN484I?

The LFE2M35E-6FN484I positions itself as a versatile, industrial-grade FPGA option for designs requiring a mix of high logic capacity, substantial embedded memory, and extensive I/O. Its combination of 34,000 logic elements, approximately 2.15 Mbits of on-chip RAM, and 303 user I/Os makes it well suited for engineers building mid-density programmable solutions in industrial, communications, and embedded system markets.

Engineers and procurement teams benefit from its compact 484-BBGA footprint and RoHS compliance, enabling integration into space-constrained, environmentally conscious products while maintaining operational robustness across a wide temperature range.

Request a quote or submit a product availability inquiry to receive pricing and lead-time information for the LFE2M35E-6FN484I.