LFE2M35E-7F256C

IC FPGA 140 I/O 256FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA

Quantity 1,881 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O140Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells34000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2151424

Overview of LFE2M35E-7F256C – ECP2M FPGA IC, 256‑BGA, 140 I/Os

The LFE2M35E-7F256C is an ECP2M family field programmable gate array (FPGA) manufactured by Lattice Semiconductor Corporation. It provides mid-range FPGA capacity with approximately 34,000 logic elements and flexible on-chip memory for embedded system and communications designs.

Built on the Lattice ECP2/M architecture, the device targets applications that require a balance of logic density, embedded memory, I/O flexibility and low-voltage operation. The device is supplied in a 256‑ball FPBGA (17 × 17 mm) package with 140 I/Os and is rated for commercial temperature operation.

Key Features

  • Logic Capacity — Approximately 34,000 logic elements suitable for mid-range integration of control, data-path and glue logic.
  • Embedded Memory — Total on-chip RAM of 2,151,424 bits (approximately 2.15 Mbits) to support FIFOs, buffering and local data storage.
  • I/O and Package — 140 user I/Os in a 256‑FPBGA (17 × 17 mm) surface-mount package for compact board-level integration.
  • Low-Voltage Core — Core supply range from 1.14 V to 1.26 V to match low-voltage system rails.
  • Commercial Temperature Grade — Specified for 0 °C to 85 °C operating range for standard commercial applications.
  • Family-Level High-Speed Options — As part of the LatticeECP2M family, the architecture supports embedded SERDES (family feature), with family data rates spanning 250 Mbps to 3.125 Gbps and protocol support for interfaces such as PCI Express and 1GbE (applicability depends on specific device and configuration).
  • Flexible Configuration and System Features — Family-level features include SPI boot flash interface, dual-boot image support and on-chip oscillator; optional bitstream encryption is available in “S” series devices.
  • Compliance — RoHS compliant and supplied as a surface-mount 256‑BGA device.

Typical Applications

  • Communications and Networking — Implement protocol bridging, packet buffering and medium-speed serial interfaces using the device’s logic capacity and on-chip RAM.
  • Embedded Systems — Integrate control logic, peripheral interfacing and custom accelerators for mid-range embedded designs.
  • Industrial and Instrumentation — Use for sensor aggregation, data pre-processing and custom I/O handling within the commercial temperature range.
  • Prototyping and Product Development — Rapidly iterate and validate digital functions where compact BGA packaging and significant logic resources are required.

Unique Advantages

  • Balanced Logic and Memory — Approximately 34,000 logic elements combined with ~2.15 Mbits of embedded RAM supports a wide range of mid-size designs without immediate need for external memory.
  • Compact BGA Packaging — 256‑FPBGA (17 × 17 mm) package delivers high I/O density in a space-efficient footprint for board-level integration.
  • Low-Voltage Operation — 1.14–1.26 V core supply aligns with modern low-voltage system architectures to simplify power delivery design.
  • Commercial-Grade Reliability — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
  • Family-Level High-Speed Interfaces — ECP2M family capabilities include embedded SERDES and common protocol support, enabling designs with high-speed serial links where required by system architecture.
  • Design Ecosystem Support — The ECP2/M family is supported by Lattice design tools and documented family-level features to accelerate implementation and bring-up.

Why Choose LFE2M35E-7F256C?

LFE2M35E-7F256C positions itself as a practical mid-range FPGA offering from Lattice’s ECP2M family, combining approximately 34,000 logic elements, significant embedded memory and 140 I/Os in a compact 256‑FPBGA package. Its low-voltage core and family-proven system features make it suitable for commercial embedded, communications and instrumentation applications where density, I/O flexibility and on-chip memory matter.

Designers seeking a scalable FPGA platform with access to family-level high-speed interface options and Lattice design tool support will find this device a convenient building block for a variety of system-level implementations.

Request a quote or submit a pricing and availability request for LFE2M35E-7F256C to obtain current lead time and quantity pricing information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up