LFE2M35E-7FN256C

The LFE2M35E-7FN256C is an ECP2M Field Programmable Gate Array (FPGA) offered in a 256-BGA (256-FPBGA, 17×17) surface-mount package. It delivers a mid-range programmable-logic option with 34,000 logic elements and approximately 2.15 Mbits of embedded memory.

With 140 I/O pins, a low-voltage supply range of 1.14 V to 1.26 V, and commercial operating temperature from 0 °C to 85 °C, this device is suited to designs that require substantial on-chip logic and memory in a compact, RoHS-compliant FPGA package.

Key Features

• Core FPGA Architecture ECP2M family device in a surface-mount 256-BGA package (256-FPBGA, 17×17) for compact board-level integration.
• Logic Resources 34,000 logic elements provide substantial programmable logic capacity for mid-density designs.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support data buffering, packet storage, and state machines without large external memory.
• I/O Capability 140 I/O pins enable support for multiple interfaces and parallel connections directly from the FPGA fabric.
• Power Operates from a core supply range of 1.14 V to 1.26 V, supporting low-voltage system architectures.
• Package & Mounting 256-BGA (256-FPBGA, 17×17) surface-mount package tailored for space-constrained PCBs and automated assembly.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for general-purpose electronics and embedded applications.
• Compliance RoHS-compliant materials for regulatory alignment in standard commercial products.

Typical Applications

• I/O-intensive interface control — Leverage 140 general-purpose I/Os to implement multi-channel interfaces and protocol bridging directly in the FPGA fabric.
• Mid-density programmable logic — Use 34,000 logic elements and ~2.15 Mbits of embedded memory for custom control, packet processing, and state-machine implementations.
• Compact board-level designs — The 256-BGA surface-mount package supports space-constrained PCBs while maintaining high integration of logic and memory on-chip.

Unique Advantages

• Substantial on-chip logic capacity: 34,000 logic elements enable complex logic implementations without immediate need for multiple devices.
• Integrated embedded memory: Approximately 2.15 Mbits of RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 140 I/O pins simplify system interfaces and reduce the need for additional interface components.
• Compact, manufacturable package: 256-FPBGA (17×17) surface-mount package supports automated assembly and dense PCB layouts.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system designs.
• Regulatory-friendly materials: RoHS compliance supports deployment in standard commercial products.

Why Choose LFE2M35E-7FN256C?

The LFE2M35E-7FN256C positions itself as a mid-density, commercially graded FPGA that balances logic capacity, embedded memory, and I/O count in a compact 256-BGA footprint. Its specifications make it suitable for designers who need significant on-chip resources and a high pin count while maintaining low-voltage operation and RoHS compliance.

This device fits design teams focused on scalable, board-level programmable logic for general-purpose embedded systems and interface-rich applications. The combination of 34,000 logic elements, approximately 2.15 Mbits of RAM, and 140 I/Os offers a robust platform for consolidating functions and reducing external component count.

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