LFE2M35SE-5F256C

The LFE2M35SE-5F256C is an ECP2M family Field Programmable Gate Array (FPGA) IC designed for commercial embedded designs that require reconfigurable logic and flexible I/O. It combines a mid-range logic capacity with on-chip RAM and a compact 256-BGA footprint for surface-mount assembly.

With 34,000 logic elements, approximately 2.15 Mbits of embedded memory and 140 general-purpose I/Os, this device targets applications that need a balance of logic density, on-chip storage and interface capability within a commercial temperature range.

Key Features

• Core Logic  34,000 logic elements provide the fabric for implementing custom logic, state machines and data-paths.
• On-Chip Memory  Approximately 2.15 Mbits of embedded memory (2,151,424 total RAM bits) for buffering, FIFOs and small lookup tables.
• I/O Resources  140 I/O pins support multiple external interfaces and peripheral connections on a single device.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match standard low-voltage FPGA power rails.
• Package & Mounting  256-BGA package (supplier device package: 256-FPBGA, 17 × 17) intended for surface-mount PCB assembly, enabling a compact footprint.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant to meet common electronic manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom logic functions and interface glue in compact embedded products where a commercial temperature range is acceptable.
• Interface Bridging and Protocol Conversion  Use the device's 140 I/Os and on-chip memory to manage parallel or serial interface adaptation and buffering.
• Control and Signal Processing  Leverage 34,000 logic elements and embedded RAM for finite state machines, control loops and moderate signal processing tasks.
• Prototyping and Development Platforms  Deploy as a reconfigurable platform for validating system logic and I/O arrangements prior to production designs.

Unique Advantages

• Balanced Logic-to-Memory Ratio: 34,000 logic elements with ~2.15 Mbits of embedded RAM enables mid-range designs that need both logic density and local storage.
• High I/O Count: 140 I/Os provide flexibility for multiple external interfaces without additional multiplexing hardware.
• Compact Surface-Mount Package: 256-FPBGA (17 × 17) minimizes board area while supporting dense pinout for complex routing.
• Low-Voltage Core Operation: 1.14 V to 1.26 V supply range aligns with standard low-voltage power architectures.
• RoHS Compliant: Meets common environmental requirements for modern electronics manufacturing.
• Commercial Grade: Rated for 0 °C to 85 °C to fit a wide range of standard commercial applications.

Why Choose LFE2M35SE-5F256C?

The LFE2M35SE-5F256C positions itself as a versatile, mid-range FPGA option for commercial embedded designs that require a mix of logic capacity, on-chip RAM and abundant I/O in a compact BGA package. Its specifications make it suitable for designers who need reconfigurable logic and memory in space-constrained surface-mount assemblies.

Choosing this device provides a clear, spec-driven foundation for projects that balance integration, board area and I/O requirements while operating within standard commercial temperature and low-voltage power envelopes.

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