LFE2M35SE-5F256I

The LFE2M35SE-5F256I is an ECP2M family Field Programmable Gate Array (FPGA) offering 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and 140 programmable I/Os. Engineered for industrial applications, this device combines a high logic count and substantial on-chip memory with a compact 256-ball BGA footprint and a 1.14 V–1.26 V core supply range.

Its specification set — including industrial-grade temperature operation from -40 °C to 100 °C and RoHS compliance — makes it suitable for designs that require robust operation across demanding environments while maintaining a compact surface-mount package.

Key Features

• Core Logic 
  34,000 logic elements to implement custom digital functions and parallel processing pipelines.
• Embedded Memory 
  Approximately 2.15 Mbits of on-chip RAM to support buffers, state machines, and local data storage without external memory.
• I/O Count 
  140 programmable I/Os for flexible interfacing to sensors, peripherals, and external buses.
• Power 
  Designed for a core voltage supply range of 1.14 V to 1.26 V to match system power domains.
• Package & Mounting 
  256-BGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Temperature & Grade 
  Industrial grade with an operating temperature range of -40 °C to 100 °C for extended environmental tolerance.
• Environmental Compliance 
  RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control and Automation — Use as a programmable logic engine to implement control algorithms, I/O aggregation, and real-time interfacing in industrial systems where extended temperature operation is required.
• Sensor and Peripheral Aggregation — Aggregate and preprocess data from multiple sensors or peripherals using available I/Os and on-chip memory for buffering and local processing.
• Embedded System Acceleration — Offload custom logic and peripheral functions from a host processor, leveraging the device’s logic capacity and embedded RAM to implement accelerators and state machines.

Unique Advantages

• Substantial Logic Capacity: 34,000 logic elements provide the headroom to implement complex custom logic and parallel datapaths without immediate need for higher-density devices.
• On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces dependency on external memory for many control and buffering tasks, simplifying board design.
• High I/O Count: 140 I/Os enable direct attachment of multiple sensors, buses, and peripherals, lowering the need for external interface chips.
• Industrial-Grade Robustness: Rated for -40 °C to 100 °C operation to meet the environmental needs of industrial deployments.
• Compact Surface-Mount Package: 256-BGA (256-FPBGA, 17×17) provides a small PCB footprint for space-constrained designs while supporting high pin count.
• Regulatory-Friendly: RoHS compliance supports environmentally responsible manufacturing and supply chain requirements.

Why Choose LFE2M35SE-5F256I?

The LFE2M35SE-5F256I positions itself as a balanced FPGA option for industrial-focused designs that require a substantial number of logic elements, meaningful on-chip memory, and a large I/O complement in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life systems deployed in challenging environments.

This device is well suited to engineers and procurement teams building control, sensor aggregation, or embedded acceleration solutions that prioritize integration and environmental robustness while maintaining a small PCB footprint and defined power domain requirements.

Request a quote or submit a parts request to obtain pricing and availability for the LFE2M35SE-5F256I. Our team can provide a formal quote and help with lead time and ordering details.