LFE2M35E-7FN672C

The LFE2M35E-7FN672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial-grade applications. It delivers a combination of high logic capacity, substantial on‑chip memory, and a large I/O count in a compact 672‑ball BGA package.

This device is suited to designs that require up to 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and extensive external interfacing through 410 I/O pins, while operating within a 1.14 V–1.26 V supply range and a 0 °C–85 °C temperature window.

Key Features

• Core Logic Capacity — Provides 34,000 logic elements to implement complex custom logic, state machines, and digital acceleration functions.
• Embedded Memory — Approximately 2.15 Mbits of on‑chip RAM to support buffering, lookup tables, and data storage for deterministic processing.
• High I/O Count — 410 I/O pins for broad external connectivity to sensors, peripherals, and high‑pin‑count interfaces.
• Power — Operates from a 1.14 V to 1.26 V supply range to match common FPGA power domains and power‑management schemes.
• Package and Mounting — Supplied in a 672‑BBGA package (supplier device package: 672‑FPBGA, 27×27) optimized for surface‑mount PCB assembly.
• Commercial Temperature Grade — Specified for operation from 0 °C to 85 °C to meet commercial application environmental ranges.
• Regulatory — RoHS compliant.

Typical Applications

• Custom Logic and Prototyping — Implement complex digital designs and iterate hardware algorithms using the device’s substantial logic element and memory resources.
• I/O‑Dense Systems — Handle multi‑channel sensor interfaces, parallel buses, or peripheral aggregation with 410 available I/O pins.
• Embedded Data Processing — Use on‑chip RAM for buffering and deterministic data handling in commercial embedded products.

Unique Advantages

• High Logic Density: 34,000 logic elements enable implementation of sizable custom logic functions without external ASICs or additional FPGAs.
• Substantial On‑Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces dependency on external memory for many buffering and LUT needs.
• Extensive Connectivity: 410 I/O pins provide flexibility to connect numerous peripherals and interfaces directly to the FPGA.
• Compact BGA Package: 672‑ball BGA (27×27) balances high pin count with a space‑efficient footprint for dense system boards.
• Commercial‑Grade Operating Range: Rated 0 °C–85 °C for reliable operation in standard commercial environments.
• RoHS Compliant: Meets RoHS requirements for restricted substances in electronics assembly.

Why Choose LFE2M35E-7FN672C?

The LFE2M35E-7FN672C positions itself as a capable, commercially graded FPGA option that combines high logic capacity, meaningful embedded memory, and a large I/O complement in a single compact package. It is well suited for designers and teams building commercial embedded systems that require significant on‑chip resources and broad external interfacing.

For development and production programs seeking scalable FPGA resources with clear electrical and thermal specifications, this Lattice Semiconductor FPGA offers a balance of integration and board‑level flexibility while complying with RoHS requirements.

Request a quote or submit a procurement inquiry to begin sourcing the LFE2M35E-7FN672C for your next design.