LFE2M35E-7F672C

The LFE2M35E-7F672C is an ECP2M family Field Programmable Gate Array designed for commercial applications that require mid-range logic capacity and high I/O density. It integrates substantial on-chip RAM and a large number of logic elements in a compact 672-ball BGA package, providing a balance of integration and board-level density for interface-rich designs.

Key Features

• Core Architecture ECP2M family FPGA architecture in a commercial-grade device.
• Logic Capacity Approximately 34,000 logic elements to implement medium-complexity digital functions.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM (2,151,424 bits) for buffering, FIFOs, and state storage.
• I/O Density 410 user I/Os to support multiple parallel interfaces and peripheral connections.
• Power Supply Operates from 1.14 V to 1.26 V, enabling integration with compatible core-power rails.
• Package & Mounting 672-FPBGA (27 × 27) / 672-BBGA package, intended for surface-mount assembly.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance RoHS-compliant material status for environmental and regulatory considerations.

Typical Applications

• Interface-rich systems Use the 410 I/Os and abundant logic elements to consolidate multiple interfaces and protocol bridges on a single device.
• Embedded buffering and data handling Leverage approximately 2.15 Mbits of on-chip RAM for buffering, packet queues, and temporary data storage.
• Mid-range digital processing Implement medium-complexity control, signal conditioning, or custom logic functions using the 34,000 logic elements.
• Compact, board-level solutions The 672-BBGA surface-mount package supports high-density PCB designs where board space and I/O count are priorities.

Unique Advantages

• High logic integration: Approximately 34,000 logic elements reduce the need for multiple discrete logic devices in mid-range designs.
• Significant on-chip RAM: Around 2.15 Mbits of embedded memory enables local buffering and state machines without external memory.
• Exceptional I/O capacity: 410 user I/Os simplify connectivity to sensors, peripherals, and external controllers.
• Compact BGA package: The 672-FPBGA (27 × 27) package delivers high pin count in a compact footprint for dense PCB layouts.
• Commercial temperature and RoHS compliance: Suitable for mainstream commercial applications while meeting RoHS material requirements.
• Low-voltage core operation: Tight 1.14 V to 1.26 V supply range supports modern low-voltage system architectures.

Why Choose LFE2M35E-7F672C?

The LFE2M35E-7F672C positions itself as a balanced mid-range FPGA option for commercial designs that need a combination of substantial logic resources, significant embedded RAM, and very high I/O availability in a compact BGA package. Its specifications make it well suited for projects that consolidate multiple interfaces, require on-chip buffering, or implement moderate digital processing without moving to larger, more complex devices.

For design teams focused on integration density and predictable commercial-temperature operation, this device offers a clear, verifiable set of capabilities—34,000 logic elements, approximately 2.15 Mbits of RAM, 410 I/Os, and a 672-ball BGA footprint—backed by RoHS compliance.

If you would like pricing, availability, or to request a formal quote for the LFE2M35E-7F672C, please submit a quote request or inquiry today.