LFE2M35E-6FN672C

The LFE2M35E-6FN672C is a commercial-grade Field Programmable Gate Array (FPGA) in the ECP2M family, offering a balance of logic capacity, on-chip memory, and high I/O count in a 672-ball BGA package. It is designed for commercial electronic systems requiring configurable digital logic, substantial embedded memory, and extensive I/O connectivity while operating within a 0°C to 85°C temperature range.

Key Features

• Logic Capacity — Provides 34,000 logic elements for implementing complex custom digital functions and state machines.
• Configurable Logic Blocks (CLBs) — 4,250 CLBs to organize and structure logic resources for scalable design partitioning.
• Embedded Memory — Approximately 2.15 Mbits of on-chip RAM for buffering, lookup tables, and small data storage needs.
• I/O Density — 410 I/O pins suitable for multi-channel interfaces, parallel buses, and multiple peripheral connections.
• Power Supply — Core voltage range from 1.14 V to 1.26 V to match system power rails and power-management plans.
• Package & Mounting — 672-BBGA (supplier package: 672-FPBGA, 27 × 27 mm) in a surface-mount format for compact PCB integration.
• Operating Range — Commercial operating temperature of 0°C to 85°C to meet typical business and consumer environments.
• Regulatory — RoHS compliant for alignment with common environmental requirements.

Typical Applications

• Interface Bridging and Aggregation — Use the 410 I/O pins and 34,000 logic elements to implement protocol translation, bus bridging, and multi-channel data aggregation.
• Data Buffering and Processing — Approximately 2.15 Mbits of embedded RAM supports buffering, packet handling, and on-chip data manipulation tasks.
• Custom Logic and Control — Programmable logic capacity and CLB count enable tailored state machines, glue logic, and control functions in commercial products.

Unique Advantages

• High Logic Density: 34,000 logic elements allow complex functions to be implemented on a single device, reducing board-level component count.
• Generous I/O Count: 410 I/O pins provide flexibility to connect multiple peripherals and interfaces without external multiplexing.
• On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces dependence on external memory for moderate buffering and lookup needs.
• Compact, Surface-Mount Package: 672-BBGA (27 × 27 mm) enables dense PCB layouts while maintaining a high pin count for system integration.
• Commercial Operating Range: Rated 0°C to 85°C for deployment in standard business and consumer environments.
• RoHS Compliant: Aligns with common environmental requirements for commercial products.

Why Choose LFE2M35E-6FN672C?

The LFE2M35E-6FN672C delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in a compact BGA package tailored for commercial-grade designs. Its resource mix makes it suitable for projects that require configurable digital logic alongside significant interface and buffering capability.

This part is a strong fit for design teams building commercial electronic systems that need scalable programmable logic, on-chip memory for moderate data handling, and a high number of I/Os for complex connectivity. Its RoHS compliance and surface-mount BGA footprint support modern manufacturing and environmental requirements.

Request a quote or submit an inquiry to obtain pricing and availability for LFE2M35E-6FN672C and to discuss how it can fit your next commercial FPGA-based design.