LFE2M35E-6FN256I

The LFE2M35E-6FN256I is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a mid-range programmable fabric with 34,000 logic elements and approximately 2.15 Mbits of on‑chip RAM to implement custom digital logic and system functions.

Designed as an industrial‑grade, surface‑mount device, this FPGA supports up to 140 I/O pins and operates from a core voltage range of 1.14 V to 1.26 V. The device is supplied in a 256‑ball BGA (256‑FPBGA, 17×17) package and is specified to operate from −40 °C to 100 °C, with RoHS compliance.

Key Features

• Core Capacity 34,000 logic elements provide substantial programmable resources for implementation of complex logic, control functions, and finite-state machines.
• Embedded Memory Approximately 2.15 Mbits of on‑chip RAM supports buffering, FIFOs, and local data storage for stateful designs.
• I/O Count Up to 140 general‑purpose I/O pins enable connectivity to multiple peripherals, sensors, and external interfaces.
• Power Operates from a core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting 256‑BGA (256‑FPBGA, 17×17) surface‑mount package supports high pin density in compact PCB layouts.
• Temperature & Reliability Industrial operating temperature range (−40 °C to 100 °C) and RoHS compliance support deployment in thermally demanding environments.

Typical Applications

• Industrial Control Systems Use the industrial temperature rating and robust I/O count for programmable control and I/O aggregation in factory automation and machine control.
• Embedded Logic and Glue Leverage 34,000 logic elements and embedded RAM to consolidate glue logic, custom protocol handling, and timing-critical control blocks on a single device.
• Space‑Constrained, High‑Pin‑Count Boards The 256‑BGA package offers high connectivity while minimizing PCB footprint for compact embedded designs.

Unique Advantages

• High Logic Density: 34,000 logic elements enable implementation of sizeable custom logic functions without external gate arrays.
• Significant On‑Chip RAM: Approximately 2.15 Mbits of embedded memory reduces dependency on external memory for buffering and local storage.
• Broad I/O Capability: 140 I/O pins provide flexibility to interface with multiple peripherals and external devices directly.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for use in thermally challenging or industrial environments.
• Compact High‑Pin Package: 256‑FPBGA (17×17) packaging balances pin count and board space for dense system integration.
• RoHS Compliant: Conforms to RoHS requirements for materials and environmental considerations.

Why Choose LFE2M35E-6FN256I?

The LFE2M35E-6FN256I positions itself as a versatile, industrial‑grade FPGA option with a balance of logic capacity, embedded memory, and I/O count suitable for mid‑complexity programmable designs. Its 1.14 V to 1.26 V core supply range, 256‑BGA packaging, and extended temperature rating make it appropriate for compact, ruggedized systems that require reliable programmable logic.

This device is well suited for engineers and designers seeking to consolidate digital functions, manage local buffering, and provide flexible I/O in industrial applications, while maintaining RoHS compliance and a compact board footprint.

Request a quote or submit a pricing inquiry today to discuss availability and volume options for the LFE2M35E-6FN256I.