LFE2M35E-6F672I

The LFE2M35E-6F672I is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a silicon-configurable logic platform featuring 34,000 logic elements and approximately 2.15 Mbits of embedded memory, suitable for complex programmable logic implementations.

Designed as a surface-mount device in a 672-ball BBGA footprint with a 27 × 27 mm supplier package outline, this industrial-grade FPGA provides up to 410 I/O pins, a narrow core voltage range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.

Key Features

• Core Logic 34,000 logic elements provide programmable fabric capacity for implementing custom digital functions and state machines.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, packet memory, and small data structures within the FPGA.
• I/O Density Up to 410 user I/O pins accommodate multi-channel interfacing and wide buses directly from the package.
• Power Core supply voltage range of 1.14 V to 1.26 V for the device core power domain.
• Package and Mounting 672-BBGA (supplier package 672-FPBGA, 27×27 mm) in a surface-mount form factor for compact board-level integration.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C to meet environmental requirements in industrial applications.
• Regulatory RoHS compliant.

Unique Advantages

• High logic capacity: 34,000 logic elements enable integration of multiple functions into a single programmable device, reducing board-level component count.
• Significant on-chip RAM: Approximately 2.15 Mbits of embedded memory supports local buffering and state storage without immediate need for external memory.
• High I/O count: 410 available I/Os simplify interfacing to peripherals, sensors, and external logic families directly from the FPGA package.
• Compact, manufacturable package: 672-BBGA (27×27 mm) surface-mount package balances pin density with a compact PCB footprint for space-constrained designs.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to suit products destined for demanding thermal environments.
• RoHS compliant: Meets lead-free and restricted-substance requirements for environmentally conscious manufacturing.

Why Choose LFE2M35E-6F672I?

The LFE2M35E-6F672I positions itself as a robust, industrial-grade FPGA option within the ECP2M family, combining substantial programmable logic, embedded memory, and a high number of I/Os in a compact 672-BBGA surface-mount package. Its defined core voltage range and extended operating temperature window make it a practical choice for designs that require consistent behavior across thermal extremes.

This device is well suited to engineers and procurement teams seeking a scalable, integrated FPGA platform that reduces external component needs while providing clear, verifiable hardware specifications for system design and qualification.

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