LFE2M35E-6FN484C

The LFE2M35E-6FN484C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor's ECP2M family. It delivers a combination of logic capacity, on-chip memory and high pin-count I/O in a compact 484-ball BGA package suited for space-constrained boards.

This device is intended for designs that require up to 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and up to 303 I/O signals while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Core Logic  Provides 34,000 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage.
• I/O Capacity  Up to 303 I/O pins to support dense connectivity and multiple parallel interfaces in a single device.
• Package and Mounting  484-BBGA (supplier package: 484-FPBGA, 23×23 mm) in a surface-mount format for compact PCB integration.
• Power  Operates from a 1.14 V to 1.26 V supply range to match system power rails and design constraints.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C for standard environmental conditions.
• Regulatory  RoHS compliant to meet lead-free and environmental requirements.

Typical Applications

• High-density I/O designs  Useful where up to 303 general-purpose I/O signals are needed for parallel interfaces, multiplexed sensors, or board-level connectivity.
• Logic-heavy custom functions  Suitable for implementations that require approximately 34,000 logic elements for glue logic, protocol bridging, or custom state machines.
• On-chip buffering and data staging  Embedded memory of approximately 2.15 Mbits supports buffering, temporary storage, and data FIFO requirements within the FPGA fabric.

Unique Advantages

• Balanced integration:  Combines substantial logic capacity and embedded memory with high I/O count in a single 484-BBGA package to reduce external components.
• Compact board footprint:  Surface-mount 484-FPBGA (23×23 mm) packaging enables high-density PCB layouts without compromising connectivity.
• Deterministic supply range:  A narrow 1.14 V to 1.26 V operating range simplifies power rail planning for systems constrained to that voltage domain.
• Commercial temperature suitability:  Rated for 0 °C to 85 °C operation, aligning with standard consumer and commercial product requirements.
• RoHS compliance:  Supports environmental and regulatory requirements for lead-free assemblies.

Why Choose LFE2M35E-6FN484C?

This FPGA targets designers who need a mid-to-high density logic device with substantial on-chip RAM and a large number of I/Os in a compact BGA footprint. Its combination of roughly 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and 303 I/O pins makes it a practical option for board-level designs that require integration of multiple functions without resorting to multiple discrete devices.

With a defined commercial temperature range, RoHS compliance, and a standardized surface-mount 484-FPBGA package, the LFE2M35E-6FN484C offers predictable electrical and mechanical characteristics for procurement and long-term design planning.

Request a quote or submit a pricing inquiry to begin procurement and get lead-time and availability information for the LFE2M35E-6FN484C.