LFE2M35E-6FN672I

The LFE2M35E-6FN672I is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It delivers 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and 410 user I/O pins in a compact 672-BBGA package for industrial applications.

Designed for surface-mount integration, the device operates from a 1.14 V to 1.26 V core supply and is rated for operation from −40 °C to 100 °C, addressing designs that require robust temperature performance and substantial on-chip resources.

Key Features

• Core Logic 34,000 logic elements for implementing medium-complexity digital functions and custom hardware acceleration.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, state machines, and localized data storage.
• I/O Capacity 410 user I/O pins for flexible interfacing to peripherals, sensors, and external circuitry.
• Power Supply Core voltage range of 1.14 V to 1.26 V to align with modern low-voltage power architectures.
• Package 672-BBGA (672-FPBGA, 27×27 mm) surface-mount package for high pin density in a compact footprint.
• Industrial Temperature Range Rated for −40 °C to 100 °C to support deployment in temperature-variable environments.
• RoHS Compliant Conforms to RoHS requirements for restricted substances.

Typical Applications

• Industrial Control Implement control logic, I/O aggregation and real-time state machines where industrial temperature operation is required.
• Embedded Systems Integrate custom logic and on-chip memory into compact OEM devices and evaluation platforms.
• Communications and Interface Bridging Implement custom interface conversion, parallel I/O handling and protocol glue logic using the device’s high I/O count.

Unique Advantages

• High Logic Density: 34,000 logic elements enable substantial functional integration within a single IC, reducing the need for multiple discrete components.
• Significant On-Chip Memory: Approximately 2.15 Mbits of embedded RAM helps minimize external memory requirements and simplifies PCB layout.
• Extensive I/O: 410 user I/O pins provide flexibility for connecting numerous peripherals and signals without additional multiplexing hardware.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for demanding industrial environments.
• Compact, High-Density Package: 672-BBGA (27×27 mm) surface-mount package offers a balance of pin count and board space efficiency.
• Regulatory Compliance: RoHS compliance simplifies integration into global product designs.

Why Choose LFE2M35E-6FN672I?

The LFE2M35E-6FN672I is positioned as a mid-range ECP2M FPGA that combines substantial logic capacity, on-chip memory, and a large I/O complement in a compact industrial-grade package. Its defined voltage and temperature specifications make it a predictable choice for engineers targeting embedded and industrial systems where integration and operating robustness are priorities.

This device is well suited to designs that benefit from consolidating logic and memory on-chip to reduce BOM complexity and board area, including control platforms, OEM embedded products, and interface-intensive applications that require reliable performance across a wide temperature range.

Request a quote or submit an inquiry to procure LFE2M35E-6FN672I for evaluation or production deployment.