LFE2M35E-7F484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA |
|---|---|
| Quantity | 1,228 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 303 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-7F484C – ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA
The LFE2M35E-7F484C is an FPGA device from Lattice Semiconductor Corporation based on the ECP2M family architecture. It provides a programmable logic fabric with 34,000 logic elements, approximately 2.15 Mbits of on-chip RAM, and 303 I/O pins in a 484-ball BGA package.
This device operates from a core supply of 1.14 V to 1.26 V, is rated for commercial temperature operation (0 °C to 85 °C), and is RoHS compliant.
Key Features
- Programmable Logic 34,000 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
- I/O Capacity 303 general-purpose I/O pins to support a wide range of external interfaces and signal connections.
- Power Supply Core voltage range of 1.14 V to 1.26 V to match modern low-voltage system rails.
- Package and Mounting 484-ball BGA package (listed as 484-BBGA and 484-FPBGA 23×23) with surface-mount mounting for compact board designs.
- Operating Range and Grade Commercial grade operation specified from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 34,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing board-level complexity.
- Substantial on-chip memory: Approximately 2.15 Mbits of embedded RAM helps minimize external memory requirements for many designs.
- Extensive I/O availability: 303 I/O pins provide flexibility for interfacing with peripherals, sensors, and multiple digital domains.
- Compact BGA footprint: 484-ball FPBGA (23×23) package supports dense PCB layouts while maintaining surface-mount assembly compatibility.
- Low-voltage core operation: 1.14–1.26 V supply allows integration with contemporary low-voltage systems.
- RoHS compliant: Meets environmental requirements for lead-free assembly.
Why Choose LFE2M35E-7F484C?
The LFE2M35E-7F484C is positioned for designs that require significant on-chip logic capacity, ample embedded memory, and a large I/O count in a compact surface-mount BGA package. Its specification set—34,000 logic elements, approximately 2.15 Mbits of RAM, 303 I/Os, and a 484-ball FPBGA package—makes it suitable for systems that need high integration at commercial temperature ranges.
Offered by Lattice Semiconductor Corporation and RoHS compliant, this device is appropriate for engineers and procurement teams looking for a programmable solution with clearly defined electrical, packaging, and temperature characteristics.
Request a quote or submit an inquiry for pricing and availability of the LFE2M35E-7F484C to get product lead-time and ordering details.
