LFE2M35E-7FN484C

IC FPGA 303 I/O 484FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA

Quantity 823 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O303Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells34000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2151424

Overview of LFE2M35E-7FN484C – ECP2M Field Programmable Gate Array (FPGA)

The LFE2M35E-7FN484C is an ECP2M family FPGA from Lattice Semiconductor Corporation. It integrates 34,000 logic elements and approximately 2.15 Mbits of on-chip RAM with 303 user I/Os in a 484-BBGA package, providing a compact, high-density programmable logic option for commercial designs. The device operates from a 1.14 V to 1.26 V supply and is specified for a 0 °C to 85 °C operating temperature range.

Key Features

  • Core Capacity  34,000 logic elements and 4,250 configurable logic blocks (CLBs) for substantial programmable logic integration.
  • Embedded Memory  Total on-chip RAM of 2,151,424 bits — approximately 2.15 Mbits of embedded memory for buffering and local storage.
  • I/O Resources  303 user I/Os to support diverse interfacing and system connectivity requirements.
  • Power  Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
  • Package and Mounting  484-BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
  • Temperature and Grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 34,000 logic elements enable substantial on-chip logic implementation without external PLD arrays.
  • Significant embedded memory: Approximately 2.15 Mbits of RAM reduce reliance on external memory for many buffering and data-path tasks.
  • Generous I/O count: 303 I/Os provide flexibility for multi-interface designs and board-level connectivity.
  • Compact BGA footprint: 484-BBGA (23×23) package balances density and board area for space-constrained applications.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range supports modern low-voltage system rails.
  • Commercial deployment-ready: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.

Why Choose LFE2M35E-7FN484C?

The LFE2M35E-7FN484C combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in a 484-BBGA surface-mount package, making it suitable for commercial applications that require moderate-to-high on-chip logic and memory integration. Its low-voltage operation and RoHS compliance provide alignment with contemporary board designs and environmental requirements.

This device is appropriate for designers seeking a compact, commercially rated FPGA from Lattice Semiconductor that delivers balanced logic capacity, embedded memory, and I/O resources in a standardized BGA package.

Request a quote or submit a product inquiry to initiate pricing and availability details for the LFE2M35E-7FN484C.

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