LFE2M35E-7FN484C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 303 2151424 34000 484-BBGA |
|---|---|
| Quantity | 823 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 303 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35E-7FN484C – ECP2M Field Programmable Gate Array (FPGA)
The LFE2M35E-7FN484C is an ECP2M family FPGA from Lattice Semiconductor Corporation. It integrates 34,000 logic elements and approximately 2.15 Mbits of on-chip RAM with 303 user I/Os in a 484-BBGA package, providing a compact, high-density programmable logic option for commercial designs. The device operates from a 1.14 V to 1.26 V supply and is specified for a 0 °C to 85 °C operating temperature range.
Key Features
- Core Capacity 34,000 logic elements and 4,250 configurable logic blocks (CLBs) for substantial programmable logic integration.
- Embedded Memory Total on-chip RAM of 2,151,424 bits — approximately 2.15 Mbits of embedded memory for buffering and local storage.
- I/O Resources 303 user I/Os to support diverse interfacing and system connectivity requirements.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V.
- Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
- Temperature and Grade Commercial grade device specified for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 34,000 logic elements enable substantial on-chip logic implementation without external PLD arrays.
- Significant embedded memory: Approximately 2.15 Mbits of RAM reduce reliance on external memory for many buffering and data-path tasks.
- Generous I/O count: 303 I/Os provide flexibility for multi-interface designs and board-level connectivity.
- Compact BGA footprint: 484-BBGA (23×23) package balances density and board area for space-constrained applications.
- Low-voltage core operation: 1.14 V to 1.26 V supply range supports modern low-voltage system rails.
- Commercial deployment-ready: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
Why Choose LFE2M35E-7FN484C?
The LFE2M35E-7FN484C combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in a 484-BBGA surface-mount package, making it suitable for commercial applications that require moderate-to-high on-chip logic and memory integration. Its low-voltage operation and RoHS compliance provide alignment with contemporary board designs and environmental requirements.
This device is appropriate for designers seeking a compact, commercially rated FPGA from Lattice Semiconductor that delivers balanced logic capacity, embedded memory, and I/O resources in a standardized BGA package.
Request a quote or submit a product inquiry to initiate pricing and availability details for the LFE2M35E-7FN484C.

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