LFE2M35SE-5F484C

The LFE2M35SE-5F484C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a programmable logic fabric with 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and up to 303 I/O pins in a compact 484-ball BGA package.

Designed for commercial-grade embedded designs, the device operates from a 1.14 V to 1.26 V supply and supports an ambient temperature range of 0 °C to 85 °C. Its combination of logic capacity, on-chip RAM, and high I/O count makes it suitable for a wide range of system integration tasks.

Key Features

• Core Logic  34,000 logic elements provide the programmable logic capacity needed for medium-complexity designs.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM for buffering, data storage, and stateful logic.
• I/O Density  303 user I/O pins allow broad interfacing to peripherals, sensors, and external devices.
• Power  Operates from a specified supply range of 1.14 V to 1.26 V to match system power rails.
• Package and Mounting  484-ball FBGA package (484-FPBGA, 23×23) in a surface-mount form factor for compact board implementations.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• I/O-intensive control and interfacing  Use the 303 I/O pins to implement multi-channel sensor interfaces, peripheral control, and board-level glue logic.
• Mid-range embedded systems  Deploy the 34,000 logic elements and on-chip memory to implement custom datapaths, protocol bridges, and control logic.
• Data buffering and packet handling  Leverage approximately 2.15 Mbits of embedded RAM for buffering, temporary storage, and state machines.

Unique Advantages

• High logic capacity: 34,000 logic elements allow implementation of substantial custom logic without external ASICs.
• Meaningful embedded memory: Approximately 2.15 Mbits of on-chip RAM reduces the need for external memory in many designs.
• Extensive I/O: 303 I/O pins support complex interfacing and multi-peripheral connectivity on a single device.
• Compact BGA footprint: 484-FPBGA (23×23) package enables dense integration on modern PCBs while maintaining surface-mount assembly.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation to match typical commercial embedded product requirements.
• RoHS compliant: Meets lead-free and environmental compliance expectations for commercial products.

Why Choose LFE2M35SE-5F484C?

The LFE2M35SE-5F484C offers a balanced combination of logic density, on-chip RAM, and high I/O count in a compact 484-ball BGA package. Its voltage and temperature specifications make it suitable for commercial embedded systems where moderate logic capacity and substantial interfacing are required.

This device is appropriate for designers seeking a programmable solution that consolidates logic, memory, and I/O in a single FPGA from Lattice Semiconductor, helping to simplify board-level design and reduce component count.

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